Difference between revisions of "Lithography Recipes"
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+ | ! colspan="7" height="45" |<div style="font-size: 150%;">Photolithography Recipes</div> |
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− | |<!-- INTENTIONALLY LEFT BLANK --><br> |
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− | ! colspan="2" bgcolor="#D0E7FF" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]''' |
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− | ! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Stepper Recipes|<big>Steppers Recipes</big>]]''' |
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+ | | bgcolor="#EAECF0" | <!-- INTENTIONALLY BLANK --> |
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+ | ! colspan="2" align="center" |'''[[Contact Alignment Recipes|<big>Contact Aligner Recipes</big>]]''' |
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+ | ! colspan="3" align="center" |'''[[Stepper Recipes|<big>Stepper Recipes</big>]]''' |
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+ | ! align="center" |Other |
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! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists''' |
! width="150" bgcolor="#D0E7FF" align="center" |'''Positive Resists''' |
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{{LithRecipe Table}} |
{{LithRecipe Table}} |
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| bgcolor="#D0E7FF" align="center" |AZ4110 |
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|{{rl|Stepper Recipes|Positive Resist (GCA 6300)}} |
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|{{rl|Stepper Recipes|Positive Resist (ASML DUV)}} |
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! bgcolor="#D0E7FF" align="center" |'''Negative Resists''' |
! bgcolor="#D0E7FF" align="center" |'''Negative Resists''' |
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{{LithRecipe Table}} |
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! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings''' |
! bgcolor="#D0E7FF" align="center" | '''Anti-Reflection Coatings''' |
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<!-- end Litho Recipes table --> |
<!-- end Litho Recipes table --> |
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− | ==E-Beam Lithography Recipes== |
+ | ==[[E-Beam Lithography System (JEOL JBX-6300FS)|E-Beam Lithography Recipes (JEOL JBX-6300FS)]]== |
*Under Development. |
*Under Development. |
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+ | |||
+ | == [[Focused Ion-Beam Lithography (Raith Velion)|FIB Lithography Recipes (Raith Velion)]] == |
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+ | ''To Be Added'' |
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==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]== |
==[[Automated Coat/Develop System (S-Cubed Flexi)|Automated Coat/Develop System Recipes (S-Cubed Flexi)]]== |
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''To Be Added'' |
''To Be Added'' |
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− | ==Nanoimprinting Recipes== |
+ | ==[[Nano-Imprint (Nanonex NX2000)|Nanoimprinting Recipes]]== |
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}} |
*{{fl|Thermal-Nanoimprint-Process-Tutorial-revA.pdf|Thermal Nanoimprint Process and Tutorial}} |
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*{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}} |
*{{fl|Nanoinprint-Lithopgraphy-UV-Low-Pressure-Temperature-Ormostamp-PDMS-RevA.docx|UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process}} |
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− | ==Holography Recipes== |
+ | ==[[Holographic Lith/PL Setup (Custom)|Holography Recipes]]== |
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_(ARC-11_%26_THMR-IP3600HP-D)-updated-8-13-2018-A.pdf|Standard Holography Process - on SiO2 on Si}} |
*{{fl|Holography_Process_for_1D-lines_and_2D-dots_(ARC-11_%26_THMR-IP3600HP-D)-updated-8-13-2018-A.pdf|Standard Holography Process - on SiO2 on Si}} |
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− | [[Category:Processing]] |
+ | [[Category: Processing]] |
+ | [[category: Lithography]] |
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+ | [[category: Recipes]] |
Revision as of 23:22, 13 September 2020
General Information
This page contains information and links to recipes/datasheets spin-coated materials used in the facility.
Table of Contents |
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Photolithography Recipes
- R = Recipe is available. Clicking this link will take you to the recipe.
- A = Material is available for use, but no recipes are provided.
Photolithography Recipes
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Contact Aligner Recipes | Stepper Recipes | Other | ||||
Positive Resists | SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) |
AZ4110 | R | R | A | A | ||
AZ4210 | R | R | A | A | ||
AZ4330RS | R | R | A | A | ||
AZ4620 | A | |||||
OCG 825-35CS | A | A | A | A | ||
SPR 950-0.8 | A | A | A | A | ||
SPR 955 CM-0.9 | A | R | R | R | ||
SPR 955 CM-1.8 | A | A | R | R | ||
SPR 220-3.0 | R | R | R | R | ||
SPR 220-7.0 | R | R | R | R | ||
THMR-IP3600 HP D | A | A | A | |||
UV6-0.8 | R | |||||
UV210-0.3 | R | |||||
UV26-2.5 | A | |||||
Negative Resists | SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) |
AZ5214-EIR | R | R | R | R | ||
AZnLOF 2020 | R | R | R | R | ||
AZnLOF 2035 | A | A | A | A | ||
AZnLOF 2070 | A | A | A | A | ||
AZnLOF 5510 | A | A | R | R | ||
UVN30-0.8 | R | |||||
SU-8 2005,2010, 2015 | A | R | A | A | ||
SU-8 2075 | A | A | A | A | ||
NR9-1000,3000,6000PY | R | R | A | R | ||
Anti-Reflection Coatings | SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) |
DUV42-P | R | |||||
DS-K101-304 | R | |||||
SUSS MJB-3 | SUSS MA-6 | Stepper 1 (GCA 6300) |
Stepper 2 (AutoStep 200) |
Stepper 3 (ASML DUV) |
MLA150 (Heidelberg) |
E-Beam Lithography Recipes (JEOL JBX-6300FS)
- Under Development.
FIB Lithography Recipes (Raith Velion)
To Be Added
Automated Coat/Develop System Recipes (S-Cubed Flexi)
Recipes pre-loaded on the S-Cubed Flexi automated coat/bake/develop system. Only staff may write new recipes, contact the tool supervisor for more info.
To Be Added
Nanoimprinting Recipes
- Thermal Nanoimprint Process and Tutorial
- UV-Cure Low Temp, Low Pressure, Soft-Stamp Nanoimprint Process
Holography Recipes
- Standard Holography Process - on SiO2 on Si
- Holography Process Variations - Set-up Angle - Etching into SiO2 and Si
- Etch SiO2 Nano-structure - Changing Side-wall Angle - Etching into Si with a different line-width
- Reduce SiO2 Nanowire Diameter - Thermal Oxidation - Vapor HF Etching
Low-K Spin-On Dielectric Recipes
Lift-Off Techniques
- Lift-Off Description/Tutorial
- How it works, process limits and considerations for designing your process
- I-Line Lift-Off: Bi-Layer Process with PMGI Underlayer and Contact Aligner
- DUV Lift-Off: UV6 Imaging Resist + PMGI Underlayer
Chemicals Stocked + Datasheets
The following is a list of the lithography chemicals we stock in the lab, with links to the datasheets for each. The datasheets will often have important processing info such as spin-speed vs. thickness curves, typical process parameters, bake temps/times etc.