Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer

Tips

Please see our Bi-Layer Lift-Off Tutorial to understand the limitations and requirements for good lift-off.

• Remember that the PR protecting the gaps between adjacent metal traces can lift-off during the develop!

• Need underlayer thickness approx. 2x the desired metal thickness.

• The underlayer will develop laterally from both sides which can lift-off the imaging resist, so:
  • Minimum gap between adjacent metals should then be: greater than 0.5 * underlayer thickness
  • Want at least 30-50nm of underlayer width left to support the imaging resist, so the PR doesn't fall over/collapse.

• Make sure to use a vertical line-of-sight evaporation such as EBeam4 or EBeam1. EBeam3 is not vertical unless special care is taken.