Difference between revisions of "Ion Beam Deposition (Veeco NEXUS)"
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(→Detailed Specifications: updated targets, AR coating) |
(→Detailed Specifications: mentioned ITO not installed, minor formatting) |
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|picture=IBD.jpg |
|picture=IBD.jpg |
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|type = Vacuum Deposition |
|type = Vacuum Deposition |
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| − | |super= |
+ | |super= Bill Millerski |
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| − | |phone=(805)839-3918x219 |
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| − | |email=silva@ece.ucsb.edu |
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|description = Ion Beam Deposition Tool |
|description = Ion Beam Deposition Tool |
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|manufacturer = Veeco |
|manufacturer = Veeco |
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|toolid=14 |
|toolid=14 |
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| − | = |
+ | =About= |
This tool is designed for high quality, precise, reproducible deposition of dielectric films for optical quality films. Metallic material is ion bombarded from a target material and a reactive ion beam of oxygen and/or nitrogen is aimed at the surface, creating a metal-oxide or nitride on the sample. |
This tool is designed for high quality, precise, reproducible deposition of dielectric films for optical quality films. Metallic material is ion bombarded from a target material and a reactive ion beam of oxygen and/or nitrogen is aimed at the surface, creating a metal-oxide or nitride on the sample. |
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The system is fully computer controlled to facilitate multi-layer stack recipes for high reflectivity or low reflectivity coatings. |
The system is fully computer controlled to facilitate multi-layer stack recipes for high reflectivity or low reflectivity coatings. |
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The high-energy sputter deposition produces denser films than other techniques, improving optical damage threshold (and thus coating lifetime). This also causes the refractive indices to be slightly higher than comparable stoichiometric films deposited by other techniques. |
The high-energy sputter deposition produces denser films than other techniques, improving optical damage threshold (and thus coating lifetime). This also causes the refractive indices to be slightly higher than comparable stoichiometric films deposited by other techniques. |
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| − | Four metallic targets can be installed |
+ | Four metallic targets can be installed (producing Oxides & Nitrides of each). Ta & Si are always available, the others are rotated out as users need them. |
The most common films for High-/Anti-Reflection (HR/AR) coatings are '''SiO<sub>2</sub>''' & '''Ta<sub>2</sub>O<sub>5</sub>''', both of which are extremely stable w/r/to refractive index. Users typically calibrate their dep. rates prior to critical deps. & multi-layer coatings. |
The most common films for High-/Anti-Reflection (HR/AR) coatings are '''SiO<sub>2</sub>''' & '''Ta<sub>2</sub>O<sub>5</sub>''', both of which are extremely stable w/r/to refractive index. Users typically calibrate their dep. rates prior to critical deps. & multi-layer coatings. |
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| − | = |
+ | =Detailed Specifications= |
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| − | *Xenon target bombardment |
+ | *Xenon sputter-target bombardment |
*Nitrogen and/or Oxygen deposition assist source for metal oxides/nitrides |
*Nitrogen and/or Oxygen deposition assist source for metal oxides/nitrides |
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| − | *Targets: Ta, Si, Al, Ti |
+ | *Available Sputter Targets: Ta, Si, Al, Ti (ITO target on-hand but not installed) |
| + | *Standard Recipes: Ta<sub>2</sub>O<sub>5</sub>, SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub>, TiO<sub>2</sub>, Al<sub>2</sub>O<sub>3</sub>. |
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| ⚫ | |||
| + | **Custom recipes: SiO<sub>x</sub>N<sub>y</sub>, AlN, TaN, TiN |
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| + | *Argon sample cleaning/pre-sputtering with low energy/etch rate |
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| − | *Ta<sub>2</sub>O<sub>5</sub> (1.33 A/s rate) and SiO<sub>2</sub> (0.85A/s)characterized, standard recipes |
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*Base Pressure ≤ 3e-8 Torr |
*Base Pressure ≤ 3e-8 Torr |
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| + | **Holders available for etched/cleaved facet coating |
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*Wide-band Anti-Reflection coatings demonstrated in near-IR (~1550nm) |
*Wide-band Anti-Reflection coatings demonstrated in near-IR (~1550nm) |
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=Documentation= |
=Documentation= |
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| + | |||
| − | * |
+ | *{{file|IBDoperationguide1.pdf|Operating Instructions Part 1}} |
| + | *{{file|IBDoperationguide2.pdf|Operating Instructions Part 2}} |
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| + | |||
| + | ==Recipes== |
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| + | |||
| + | *[[Sputtering_Recipes#Ion_Beam_Deposition_.28Veeco_NEXUS.29|Sputtering Recipes: Ion Beam Deposition (Veeco NEXUS)]] |
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| + | **''Dep Rates, Refractive Indices etc. for various available dielectric coatings'' |
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| + | *[[IBD: Calibrating Optical Thickness|Method for accurately calibrating optical films]]: For example, for calibrating and depositing Multi-layer DBR gratings, Anti-Reflection coatings etc. |
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Revision as of 17:15, 10 May 2022
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About
This tool is designed for high quality, precise, reproducible deposition of dielectric films for optical quality films. Metallic material is ion bombarded from a target material and a reactive ion beam of oxygen and/or nitrogen is aimed at the surface, creating a metal-oxide or nitride on the sample. The system is fully computer controlled to facilitate multi-layer stack recipes for high reflectivity or low reflectivity coatings. The system is load locked and can handle wafers up to 6” in diameter as well as small pieces. Sample rotation and angling is used to facilitate material quality and allows for sidewall coverage on non-planar surfaces. Uniformity is better than 1.5% over 6" wafers and reproducibility is expected to be within one percent (with pre-dep calibration). The high-energy sputter deposition produces denser films than other techniques, improving optical damage threshold (and thus coating lifetime). This also causes the refractive indices to be slightly higher than comparable stoichiometric films deposited by other techniques.
Four metallic targets can be installed (producing Oxides & Nitrides of each). Ta & Si are always available, the others are rotated out as users need them.
The most common films for High-/Anti-Reflection (HR/AR) coatings are SiO2 & Ta2O5, both of which are extremely stable w/r/to refractive index. Users typically calibrate their dep. rates prior to critical deps. & multi-layer coatings.
Detailed Specifications
- Full programmable control through GUI, designed for multi-layer optical coatings
- Xenon sputter-target bombardment
- Nitrogen and/or Oxygen deposition assist source for metal oxides/nitrides
- Available Sputter Targets: Ta, Si, Al, Ti (ITO target on-hand but not installed)
- Standard Recipes: Ta2O5, SiO2, Si3N4, TiO2, Al2O3.
- Custom recipes: SiOxNy, AlN, TaN, TiN
- Argon sample cleaning/pre-sputtering with low energy/etch rate
- Base Pressure ≤ 3e-8 Torr
- Accepts small pieces, up to 6” wafers accepted
- Holders available for etched/cleaved facet coating
- High quality, High Reflectivity DBR (>99.5%) mirrors demonstrated at UV-Vis & near-IR wavelengths
- Wide-band Anti-Reflection coatings demonstrated in near-IR (~1550nm)
Documentation
Recipes
- Sputtering Recipes: Ion Beam Deposition (Veeco NEXUS)
- Dep Rates, Refractive Indices etc. for various available dielectric coatings
- Method for accurately calibrating optical films: For example, for calibrating and depositing Multi-layer DBR gratings, Anti-Reflection coatings etc.