IR Aligner (SUSS MJB-3 IR)

IR Aligner (SUSS MJB-3 IR) Tool Type Lithography Location Bay 6 Supervisor Lee Sawyer Supervisor Phone (805) 893-2123 Supervisor E-Mail lee_sawyer@ucsb.edu Description Mask Aligner - MJB 3 UV400 IR Manufacturer Karl Suss America Sign up for this tool

About

This is a high-performance contact mask aligner with backside alignment capability for opaque materials using IR. It is a versatile, user-friendly compact unit that has a foot print of 600 x 800 mm². The resolution (depending on contact mode, optics and exposure wavelength and "operator technique") is down to 1 micron (hard contact). The aligner is configured for the near-UV window (365 and 405 nm). Exposures can be done on substrates from small "piece parts" of less than 1 cm square to substrates of 3 inch diameter or square. Masks up to 4 inches in size can be used although patterns should be well away from the mask plate edges due to the fact such plates can only be shifted a limited distance in the x and y.

Detailed Specifications

• Wafer size: 3" max. for vacuum mode; 4” for soft contact (3” x 3” exposure area)
• Substrate size: 3" x 3" max.
• Wafer / substrate thickness: 0-4.5 mm
• Exposure optics:
  • 280-450 nm/200 W mercury lamp (can filter to 350 nm)
• Uniformity:
  • ±3% over 2" diameter
  • ±5% over 3" diameter

Special Notes / Additional Comments

• 200 W mercury lamp
• Top side alignment (visible) can be performed on this aligner as well with a quick tooling change
• Infrared Transmission Alignment System:
  • Motor positioned IR light source under chuck
  • Special glass chucks transparent to IR but opaque to UV and visible light
  • In-line video camera/monitor for substrate backside viewing and alignment to front-side
• This aligner does not support vacuum contact mode
• For processes using this tool please go to the contact lithography process page

Documentation

• MJB 3 Standard Operating Procedure
• MJB 3 IR Alignment Mode Conversion Procedure
• MJB 3 IR Camera Operating Procedure