Difference between revisions of "ICP Etching Recipes"

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== Al2O3 Etching (Panasonic 2) ==
 
== Al2O3 Etching (Panasonic 2) ==
 
[[:Media:Brian Markman - Al2O3 ICP2 Etch Rates 2018.pdf|ALD Al2O3 Etch Rates in BCl3 Chemistry]] (click for plots of etch rate)
 
[[:Media:Brian Markman - Al2O3 ICP2 Etch Rates 2018.pdf|ALD Al2O3 Etch Rates in BCl3 Chemistry]] (click for plots of etch rate)
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''Contributed by Brian Markman, 2018''
 
* BCl3 = 30sccm
 
* BCl3 = 30sccm
 
* Pressure = 0.50 Pa
 
* Pressure = 0.50 Pa

Revision as of 18:01, 6 February 2018

Back to Dry Etching Recipes.

DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)

High Rate Bosch Etch (DSEIII)

Single-Step Low Etch Rate Smooth Sidewall Process (DSEIII)

Si Deep RIE (PlasmaTherm/Bosch Etch)

Bosch and Release Etch (Si Deep RIE)

  • Bosch and Release Processes
    • Ideal for deep (>>1µm), vertical etching of Silicon. Through-wafer etches are possible (requires carrier wafer).
    • Etch rate depends on area of exposed silicon being etched.
    • Al2O3 mask (ALD or Sputter) has >9000:1 selectivity
    • SiO2 (PECVD) mask has ~100:1 selectivity
    • Thermal SiO2 has ~300:1 selectivity.

Single-step Si Etching (not Bosch Process!) (Si Deep RIE)

ICP Etch 1 (Panasonic E626I)

SiO2 Etching (Panasonic 1)

SiNx Etching (Panasonic 1)

Al Etch (Panasonic 1)

Cr Etch (Panasonic 1)

Ti Etch (Panasonic 1)

W-TiW Etch (Panasonic 1)

GaAs-AlGaAs Etch (Panasonic 1)

GaN Etch (Panasonic 1)

SiC Etch (Panasonic 1)

Sapphire Etch (Panasonic 1)

ICP Etch 2 (Panasonic E640)

Recipes starting points for materials without processes listed can be obtained from Panasonic1 recipe files. The chambers are slightly different, but essentially the same, requiring only small program changes to obtain similar results.

SiO2 Etching (Panasonic 2)

SiNx Etching (Panasonic 2)

Al Etch (Panasonic 2)

Al2O3 Etching (Panasonic 2)

ALD Al2O3 Etch Rates in BCl3 Chemistry (click for plots of etch rate)

Contributed by Brian Markman, 2018

  • BCl3 = 30sccm
  • Pressure = 0.50 Pa
  • ICP Source RF = 500
  • Bias RF = 50W or 250W (250W can burn PR)
  • Cooling He Flow/Pressure = 15.0 sccm / 400 Pa
  • Etch Rate 50W: 0.66nm/sec
  • Etch Rate 250W: 1.0 nm/sec

GaAs Etch (Panasonic 2)

ICP-Etch (Unaxis VLR)

GaAs-AlGaAs Etch (Unaxis VLR)

InP-InGaAs-InAlAs Etch (Unaxis VLR)

GaN Etch (Unaxis VLR)

GaSb Etch (Unaxis VLR)