ICP Etch 1 (Panasonic E646V)

ICP Etch 1 (Panasonic E646V) Location Bay 2 Tool Type Dry Etch Manufacturer Panasonic Factory Solutions, Japan Model E646V Description ICP Etching and Ashing Multi-Chamber Tool Primary Supervisor Lee Sawyer (805) 893-2123 lee_sawyer@ucsb.edu Secondary Supervisor Don Freeborn Recipes Dry Etch RecipesN/A SignupMonkey: Sign up for this tool

About

This is a three-chamber tool for etching of a variety of materials.

Chamber one "Etch Chamber" is configured as an ICP etching tool with 1000 W ICP power, 500 W RF substrate power, and RT - 80°C operation with back-side He cooling and an electrostatic chuck to maintain controlled surface temperatures during etching.

This chamber has the following dedicated gas sources: Cl₂, BCl₃, and O₂

The chamber also has the following gas sources, where two of the lines must be manually switched between the two options shown (gasses can't be used simultaneously): N₂/He, CHF₃/Ar and CF₄ /SF₆

The system can be used to etch a variety of materials from SiO₂ to metals to compound semiconductors. The chamber is evacuated with a 2000 lpm Osaka Vacuum magnetically levitated turbo pump, and is load-locked for fast pump down.

The in-situ laser monitor installed on the etch chamber allows for repeatable etches and endpoint detection via continuous optical monitoring of the wafer reflectivity in a user-determined location, through a porthole on the chamber.

Chamber two, "Ashing Chamber" is a 2000 W ICP chamber configures for plasma "ashing" of photoresist and other materials such as BCB. The substrate is not biased for isotropic etching, and the chamber has CF₄ and O₂ for the gases. This is especially well-suited for omni-directional etching of photoresist/PR removal, or BCB etch-back.

Chamber three "Rinse Chamber" is a DI rinsing chamber that is not used/offline.

The system accepts 6” wafers with SEMI-std. flats. Users often mount smaller pieces to the wafers, usually with easily removable oil to improve uniform heat-sinking.

In Automatic mode, multiple wafers can be run through automatically with the cassette-based system.

Detailed Specifications

• 1000 W ICP source, 500 W RF Sample Bias Source in etching chamber
• Multiple 6” diameter wafer capable system
• Pieces possible by mounting to 6” wafer

Etch Chamber:

• Optimal Emission Monitoring
• Etch pressure from 0.1 Pa to 5 Pa (0.75 mT - 37.5 mT)
• Cl₂, BCl₃, O_2, (CHF₃ or Ar), (CF₄ or SF₆), and (N₂ or He) in etch chamber
• Room Temp - 80°C sample temperature for etching. Default 12°C Chuck Temperature.
• Laser Etch Monitoring: Intellemetrics LEP 500

Ashing Chamber:

• 2000 W ICP ashing chamber
• RT - 250°C sample temperature for ashing
• Ashing pressures 50 mT - 500 mT
• O₂, N₂, CF₄, H₂O Vapor for ashing chamber
• Room Temp. to 270°C etching. Default 50°C.

Documentation

• [1]Panasonic _1_instructions.pdf
• ICP #1 Gas Change Procedure: CF₄-SF₆-CF₄
• ICP #1 Gas Change Procedure: CHF₃-Ar-CHF₃
• ICP #1 Gas Change Procedure: N₂-He-N₂
• ICP #1 Rules and Important Notes
• ICP #1 Standard Recipes
• ICP #1 Wafer Type Change Procedure
• Laser Etch Monitor procedures

Recipes

• Recipes > Dry Etching > ICP Etch 1 page lists all qualified and contributed recipes for this tool.
  • Starting point recipes for ICP#1
• Process Control Data
  • Historical Data records "calibration" etches to test tool performance.
• The Recipes > Dry Etching Recipes
  • Master table lists all contributed dry etches vs etched materials across tools.