Difference between revisions of "Flip-Chip Bonder (Finetech)"

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{{tool|{{PAGENAME}}
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{{tool2|{{PAGENAME}}
 
|picture=FinetechFlip.jpg
 
|picture=FinetechFlip.jpg
 
|type = Packaging
 
|type = Packaging
 
|super= Tony Bosch
 
|super= Tony Bosch
|phone=(805)839-3918x217
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|super2= Bill Millerski
 
|location=Bay 3
 
|location=Bay 3
|email=bosch@ece.ucsb.edu
 
 
|description = Finetech Flip Chip Bonder
 
|description = Finetech Flip Chip Bonder
 
|manufacturer = [http://www.finetechusa.com/bonders/products/fineplacerr-lambda.html Finetech]
 
|manufacturer = [http://www.finetechusa.com/bonders/products/fineplacerr-lambda.html Finetech]

Latest revision as of 11:22, 30 August 2022

Flip-Chip Bonder (Finetech)
FinetechFlip.jpg
Location Bay 3
Tool Type Packaging
Manufacturer Finetech
Description Finetech Flip Chip Bonder

Primary Supervisor Tony Bosch
(805) 893-3486
bosch@ece.ucsb.edu

Secondary Supervisor

Bill Millerski


Recipes

SUM Link Sign up for this tool


About

The Finetech Fineplacer Lambda tool is designed for flip-chip bonding of two parts with an alignment accuracy of about 1um. The system is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 500um on a side to as large as 50mm on a side can be accommodated. Forces from as small as 0.3N to as large as 500N can be applied to the parts. Bonding temperatures up to 400C are possible. The system also has a formic acid module (reduced atmosphere environment) that is used to prevent oxide formation during heated indium bonding.