Difference between revisions of "Filmetrics F40-UV Microscope-Mounted"

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{{tool
[[File:Filmetrics F40-UV - system pic 01.jpg|alt=Photograph of the system.|thumb|300x300px|Photograph of the F40-UV microsscope.]]
 
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|super = Ning Cao
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|picture=Filmetrics F40-UV - system pic 01.jpg
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|type = Inspection,_Test_and_Characterization
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|location = Bay #4
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|description = Measures surface topography, step heights and roughness with white-light interferometry.
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|manufacturer = Filmetrics Inc.
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|model = F40-UV
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}}
 
<!-- [[File:Filmetrics F40-UV - system pic 01.jpg|alt=Photograph of the system.|thumb|300x300px|Photograph of the F40-UV microscope.]] -->
   
 
== About ==
 
== About ==

Revision as of 23:19, 21 May 2019

Filmetrics F40-UV Microscope-Mounted
Filmetrics F40-UV - system pic 01.jpg
Tool Type Inspection,_Test_and_Characterization
Location Bay #4
Supervisor Ning Cao
Supervisor Phone (805) 893-4689
Supervisor E-Mail ningcao@ece.ucsb.edu
Description Measures surface topography, step heights and roughness with white-light interferometry.
Manufacturer Filmetrics Inc.
Model F40-UV



About

The Filmetrics F40-UV is a microscope-mounted thin-film measurement system, allowing you to non-destructively measure thin-film thicknesses in small (patterned) areas on your sample. It is an optical reflectometer, acquiring reflection spectra between 400-900nm optical wavelengths (Vis to Near-IR) with a regular halogen microscope light source. The Filmetrics software then performs curve-fitting to determine the thickness and/or refractive index of the measured films.

Capabilities

  • Measure optically transparent thin-films down to ~30nm thickness.
  • Microscope Objectives: 10x, 20x, 50x, 100x, 150x
  • Acquire Optical Reflection Spectra from 400-900nm
  • Spectrometer/Detector is capable of detecting down to UV ~190nm, but light source does not support this wavelength.
  • Reflectivity curve-fitting for thin-film thickness analysis, supporting many common materials (Si3N4, SiO2 dielectrics, Si, GaAs, InP semiconductors, metals, photoresists etc.)

Operating Procedures