Difference between revisions of "File:SiO2 Etch, Ru HardMask - Fluorine ICP Etch Process - Ning Cao 2019-06.pdf"

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(Procedure for SiO2 deep etching on Plasma-Therm SLR Fluorine Etcher, using Sputtered Ruthenium hardmask)
 
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Revision as of 11:56, 9 June 2020

Summary

Procedure for SiO2 deep etching on Plasma-Therm SLR Fluorine Etcher, using Sputtered Ruthenium hardmask

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Date/TimeDimensionsUserComment
current12:01, 9 June 2020 (1.08 MB)John d (talk | contribs)updated TOC and heading styles
11:56, 9 June 2020 (1.08 MB)John d (talk | contribs)added TOC, minor formatting
11:29, 9 June 2020 (1.13 MB)John d (talk | contribs)Procedure for SiO2 deep etching on Plasma-Therm SLR Fluorine Etcher, using Sputtered Ruthenium hardmask

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