Difference between revisions of "E-Beam 3 (Temescal)"

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{{tool|{{PAGENAME}}
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{{tool2|{{PAGENAME}}
 
|picture=e-beam3.jpg
 
|picture=e-beam3.jpg
 
|type = Vacuum Deposition
 
|type = Vacuum Deposition
|super= Don Freeborn
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|super= Michael Barreraz
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|super2= Aidan Hopkins
 
|phone=(805)839-3918x216
 
|phone=(805)839-3918x216
 
|location=Bay 3
 
|location=Bay 3
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|materials =  
 
|materials =  
 
|toolid=9
 
|toolid=9
}}  
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}}
= About  =
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[[File:EBeam3 Controls.jpeg|thumb|EBeam#3 controls]]
  
This electron-beam evaporation system is the work-horse of the lab for metal deposition. The system has the unique feature of a home-built load-lock system that allows very quick cycle time for evaporation (as low as 20 minutes total time). The system also has two 4-pocket e-beam sources and an Inficon IC/5 deposition controller that allows for co-deposition of certain metals. The front gun contains metals Ti, Pt, Ni, Au and the back gun contains metals Pd, Al, Ag, Ge. These metals stay under high vacuum at all times, except during maintenance, to maintain source purity. One wafer up to 4” diameter or multiple pieces can be placed into this system for evaporation. There is also a special fixture that can be inserted for angling and/or rotating the sample during deposition. This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1 micron.
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=About=
  
= Detailed Specifications =
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This electron-beam evaporation system is the work-horse of the lab for metal deposition. The system has the unique feature of a home-built load-lock system that allows very quick cycle time for evaporation (as low as 20 minutes total time). The system also has two 4-pocket e-beam sources and an Inficon IC/5 deposition controller that allows for co-deposition of certain metals. The front gun contains metals Ti, Pt, Ni, Au and the back gun contains metals Pd, Al, Ag, Ge. These metals stay under high vacuum at all times, except during maintenance, to maintain source purity. One wafer up to 4” diameter or multiple pieces can be placed into this system for evaporation. There is also a special fixture that can be inserted for angling the sample during deposition. This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1 micron.
  
*Temescal CV-6S 10kV power supply
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=Detailed Specifications=
*2-Temescal 4-pocket series 260 e-beam sources
 
*Turbo-pumped system with ~ 5e-8 ultimate base pressure
 
*Load-lock for quick turn-around
 
*Automatic vacuum sequencing
 
  
 +
*Temescal CV-6S 10kV power supply
 +
*2-Temescal 4-pocket series 260 e-beam sources
 +
*Cryo-pumped system with ~ 5e-7 ultimate base pressure
 +
*Load-lock for quick turn-around
 +
*Automatic vacuum sequencing
  
*Temescal Super Sweep e-beam sweep control  
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*Inficon IC/5 programmable crystal thickness monitoring system  
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*Temescal Super Sweep e-beam sweep control
*Sample size: 1 wafer up to 4” diameter  
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*Inficon IC/5 programmable crystal thickness monitoring system
 +
*Sample size: 1 wafer up to 4” diameter
 
*Metals:
 
*Metals:
 
**Front Gun: Ti, Pt, Ni, Au
 
**Front Gun: Ti, Pt, Ni, Au
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=Documentation=
 
=Documentation=
Operating Procedures]].pdf|Operating Procedures]]
 
  
= Materials Table =
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*{{file|EB -3 OPERATING INSTRUCTIONS docx.pdf|E-Beam#3 operating instructions}}
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 +
=Materials Table=
 
For the materials tables, please visit the [[E-Beam_Evaporation_Recipes#Materials_Table_(E-Beam #3)|E-Beam Recipe Page]].
 
For the materials tables, please visit the [[E-Beam_Evaporation_Recipes#Materials_Table_(E-Beam #3)|E-Beam Recipe Page]].

Latest revision as of 12:11, 8 September 2022

E-Beam 3 (Temescal)
E-beam3.jpg
Location Bay 3
Tool Type Vacuum Deposition
Manufacturer Temescal
Description Load Locked Metal Evaporator Dual Gun

Primary Supervisor Michael Barreraz
(805) 893-4147
mikebarreraz@ece.ucsb.edu

Secondary Supervisor

Aidan Hopkins


Recipes Vacuum Deposition Recipes

SUM Link Sign up for this tool


EBeam#3 controls

About

This electron-beam evaporation system is the work-horse of the lab for metal deposition. The system has the unique feature of a home-built load-lock system that allows very quick cycle time for evaporation (as low as 20 minutes total time). The system also has two 4-pocket e-beam sources and an Inficon IC/5 deposition controller that allows for co-deposition of certain metals. The front gun contains metals Ti, Pt, Ni, Au and the back gun contains metals Pd, Al, Ag, Ge. These metals stay under high vacuum at all times, except during maintenance, to maintain source purity. One wafer up to 4” diameter or multiple pieces can be placed into this system for evaporation. There is also a special fixture that can be inserted for angling the sample during deposition. This system is used for n-type ohmic contact metalization to compound semiconductors, Schottky contacts to semiconductors, bond pads, and other general metalizations. The maximum deposition thickness during a run is limited to 1 micron.

Detailed Specifications

  • Temescal CV-6S 10kV power supply
  • 2-Temescal 4-pocket series 260 e-beam sources
  • Cryo-pumped system with ~ 5e-7 ultimate base pressure
  • Load-lock for quick turn-around
  • Automatic vacuum sequencing


  • Temescal Super Sweep e-beam sweep control
  • Inficon IC/5 programmable crystal thickness monitoring system
  • Sample size: 1 wafer up to 4” diameter
  • Metals:
    • Front Gun: Ti, Pt, Ni, Au
    • Rear Gun: Pd, Al, Ag, Ge

Documentation

Materials Table

For the materials tables, please visit the E-Beam Recipe Page.