Difference between revisions of "Dry Etching Recipes"

Revision as of 13:01, 8 January 2018

R = Recipe is available. Clicking this link will take you to the recipe.

Dry Etching Recipes
	RIE Etching				ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A			R	R
Au																R
Cr				A			R	A
Cu
Ge														A
Mo
Ni																R
Pt																R
Ru
Si					A	R								R
Ta
Ti							R	A
Al₂O₃
Al₂O_{3 (Sapphire)}							R	A
AlGaAs				R			R		R
AlGaN									R
AlN									R
CdZnTe		R
GaAs				R			R	R	R
GaN				R			R		R
GaSb								A	R
HfO₂
InGaAlAs		R							R
InGaAsP		R							R
InP		R					A	A	R
ITO		R
Photoresist & ARC			A	A			A	A		A	A
SiC							R	A
SiN			R				R	R		A
SiO₂			R				R	R							R
SiOxNy
Ta₂O₅								A
TiN
TiO₂
W-TiW							R	A
ZnO₂
ZnS		R
ZnSe		R
ZrO₂
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

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