Difference between revisions of "Dry Etching Recipes"

Revision as of 15:16, 6 November 2017

R = Recipe is available. Clicking this link will take you to the recipe.

Dry Etching Recipes
	RIE Etching				ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A			R	R
Au																R
Cr				A			R	A
Cu
Ge
Mo
Ni																R
Pt																R
Ru
Si						R								R
Ta
Ti							R	A
Al₂O₃
Al₂O_{3 (Sapphire)}							R	A
AlGaAs				R			R		R
AlGaN									R
AlN									R
CdZnTe		R
GaAs				R			R	R	R
GaN				R			R		R
GaSb								A	R
HfO₂
InGaAlAs		R							R
InGaAsP		R							R
InP		R					A	A	R
ITO		R
SiC							R	A
SiN			R				R	R
SiO₂			R				R	R							R
SiOxNy
Ta₂O₅								A
TiN
TiO₂
W-TiW							R	A
ZnO₂
ZnS		R
ZnSe		R
ZrO₂
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)		Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

@@ Line 15: / Line 15: @@
 | width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
 | width="100" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#DSEIII.28PlasmaTherm.2FBosch_Etch.29|DSEIII<br>(PlasmaTherm)]]
-|DSEIII (PlasmaTherm)
 | width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
 | width="120" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]