Difference between revisions of "Dry Etching Recipes"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
m (partially alphabetized and removed one spurious row)
m (alphabetized mostly)
Line 128: Line 128:
 
|
 
|
 
|
 
|
  +
|- bgcolor="#EEFFFF"
|-
 
! bgcolor="#D0E7FF" align="center" | Ni
+
! bgcolor="#D0E7FF" align="center" | Mo
 
|
 
|
 
|
 
|
Line 144: Line 144:
 
|
 
|
 
|
 
|
  +
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | Pt
+
! bgcolor="#D0E7FF" align="center" | Ni
 
|
 
|
 
|
 
|
Line 161: Line 161:
 
|
 
|
 
|
 
|
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
+
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | Ti
+
! bgcolor="#D0E7FF" align="center" | Pt
  +
|
  +
|
 
|
 
|
 
|
 
|
Line 169: Line 171:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|Ti Etch(Panasonic 1)}}
 
| A
 
 
|
 
|
 
|
 
|
Line 176: Line 176:
 
|
 
|
 
|
 
|
|
 
 
|
 
|
 
|
 
|
  +
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|-
 
|-
 
! bgcolor="#D0E7FF" align="center" | Ru
 
! bgcolor="#D0E7FF" align="center" | Ru
Line 196: Line 196:
 
|
 
|
 
|
 
|
  +
|-
|- bgcolor="#EEFFFF"
 
! bgcolor="#D0E7FF" align="center" | Mo
+
! bgcolor="#D0E7FF" align="center" | Ta
 
|
 
|
 
|
 
|
Line 214: Line 214:
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | Ta
+
! bgcolor="#D0E7FF" align="center" | Ti
 
|
 
|
 
|
 
|
Line 220: Line 220:
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|Ti Etch(Panasonic 1)}}
  +
| A
 
|
 
|
 
|
 
|
Line 225: Line 227:
 
|
 
|
 
|
 
|
  +
|
 
|
 
|
  +
|
  +
|-
  +
! bgcolor="#D0E7FF" align="center" | Al<sub>2</sub>O<sub>3</sub>
 
|
 
|
 
|
 
|
|
 
|
 
|- bgcolor="#EEFFFF"
 
! bgcolor="#D0E7FF" align="center" | W-TiW
 
 
|
 
|
 
|
 
|
Line 237: Line 239:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|W-TiW Etch(Panasonic 1)}}
 
| A
 
 
|
 
|
 
|
 
|
Line 248: Line 248:
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | Al<sub>2</sub>O<sub>3</sub>
+
! bgcolor="#D0E7FF" align="center" | AlGaAs
|
 
|
 
|
 
|
 
 
|
 
|
 
|
 
|
 
|
 
|
  +
|{{rl|RIE Etching Recipes|AlGaAs Etch (RIE 5)}}
 
|
 
|
  +
|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
 
|
 
|
  +
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
 
|
 
|
 
|
 
|
Line 264: Line 263:
 
|
 
|
 
|
 
|
  +
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | HfO<sub>2</sub>
+
! bgcolor="#D0E7FF" align="center" | AlGaN
|
 
|
 
 
|
 
|
 
|
 
|
Line 275: Line 273:
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
|
 
|
 
|
 
|
Line 280: Line 279:
 
|
 
|
 
|
 
|
  +
|
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | ITO
+
! bgcolor="#D0E7FF" align="center" | AlN
 
|
 
|
| {{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 
 
|
 
|
 
|
 
|
Line 291: Line 290:
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
|
 
|
 
|
 
|
Line 299: Line 299:
 
|
 
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | SiO<sub>2</sub>
+
! bgcolor="#D0E7FF" align="center" | GaAs
 
|
 
|
 
|
 
|
| {{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
 
 
|
 
|
  +
| {{rl|RIE Etching Recipes|AlGaAs Etch (RIE 5)}}
  +
|
  +
|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
  +
|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
  +
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
 
|
 
|
| {{rl|ICP Etching Recipes|SIO2Etch(Panasonic 1)}}
 
| {{rl|ICP Etching Recipes|SIO2Etch(Panasonic 2)}}
 
 
|
 
|
 
|
 
|
Line 312: Line 314:
 
|
 
|
 
|
 
|
|
 
| {{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
 
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | SiN
+
! bgcolor="#D0E7FF" align="center" | GaN
 
|
 
|
 
|
 
|
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
 
 
|
 
|
  +
|{{rl|RIE Etching Recipes|RIE 5 (PlasmaTherm)|GaN Etch (RIE 5)}}
 
|
 
|
| {{rl|ICP Etching Recipes|SINxEtch(Panasonic 1)}}
+
| {{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
| {{rl|ICP Etching Recipes|SINxEtch(Panasonic 2)}}
 
 
|
 
|
  +
| {{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
|
 
|
 
|
 
|
Line 333: Line 333:
 
|
 
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | SiOxNy
+
! bgcolor="#D0E7FF" align="center" | HfO<sub>2</sub>
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|-
 
! bgcolor="#D0E7FF" align="center" | Ta<sub>2</sub>O<sub>5</sub>
 
 
|
 
|
 
|
 
|
Line 367: Line 350:
 
|
 
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | TiO<sub>2</sub>
+
! bgcolor="#D0E7FF" align="center" | InGaAlAs
|
 
|
 
 
|
 
|
  +
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|
 
|
 
|
 
|
Line 376: Line 358:
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
|
 
|
 
|
 
|
Line 384: Line 367:
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | TiN
+
! bgcolor="#D0E7FF" align="center" | InGaAsP
|
 
|
 
 
|
 
|
  +
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|
 
|
 
|
 
|
Line 393: Line 375:
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
|
 
|
 
|
 
|
Line 401: Line 384:
 
|
 
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | ZnO<sub>2</sub>
+
! bgcolor="#D0E7FF" align="center" | InP
|
 
|
 
 
|
 
|
  +
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|
 
|
 
|
 
|
Line 410: Line 392:
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
|
 
|
 
|
 
|
Line 418: Line 401:
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | ZrO<sub>2</sub>
+
! bgcolor="#D0E7FF" align="center" | ITO
|
 
 
|
 
|
  +
| {{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 
|
 
|
 
|
 
|
Line 431: Line 414:
 
|
 
|
 
|
 
|
  +
|
 
|
 
|
 
|
 
|
|
 
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | GaAs
+
! bgcolor="#D0E7FF" align="center" | SiO<sub>2</sub>
 
|
 
|
 
|
 
|
  +
| {{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
 
|
 
|
| {{rl|RIE Etching Recipes|AlGaAs Etch (RIE 5)}}
 
|
 
|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
 
|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
 
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
 
 
|
 
|
  +
| {{rl|ICP Etching Recipes|SIO2Etch(Panasonic 1)}}
  +
| {{rl|ICP Etching Recipes|SIO2Etch(Panasonic 2)}}
 
|
 
|
 
|
 
|
Line 450: Line 431:
 
|
 
|
 
|
 
|
  +
|
  +
| {{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | AlGaAs
+
! bgcolor="#D0E7FF" align="center" | SiN
 
|
 
|
 
|
 
|
  +
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
 
|
 
|
|{{rl|RIE Etching Recipes|AlGaAs Etch (RIE 5)}}
 
 
|
 
|
|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
+
| {{rl|ICP Etching Recipes|SINxEtch(Panasonic 1)}}
  +
| {{rl|ICP Etching Recipes|SINxEtch(Panasonic 2)}}
 
|
 
|
|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
 
 
|
 
|
 
|
 
|
Line 466: Line 449:
 
|
 
|
 
|
 
|
  +
|
 
|
 
|
|
 
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | InGaAlAs
+
! bgcolor="#D0E7FF" align="center" | SiOxNy
  +
|
  +
|
 
|
 
|
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
 
|
 
|
 
|
 
|
Line 477: Line 461:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
 
|
 
|
 
|
 
|
Line 486: Line 469:
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | InGaAsP
+
! bgcolor="#D0E7FF" align="center" | Ta<sub>2</sub>O<sub>5</sub>
  +
|
  +
|
 
|
 
|
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
 
|
 
|
 
|
 
|
Line 494: Line 478:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
|
 
 
|
 
|
  +
|
 
|
 
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | InP
+
! bgcolor="#D0E7FF" align="center" | TiO<sub>2</sub>
  +
|
  +
|
 
|
 
|
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
 
|
 
|
 
|
 
|
Line 511: Line 495:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
 
|
 
|
 
|
 
|
Line 520: Line 503:
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | GaN
+
! bgcolor="#D0E7FF" align="center" | TiN
  +
|
  +
|
  +
|
 
|
 
|
 
|
 
|
 
|
 
|
|{{rl|RIE Etching Recipes|RIE 5 (PlasmaTherm)|GaN Etch (RIE 5)}}
 
 
|
 
|
| {{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
 
 
|
 
|
| {{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
 
|
 
|
 
|
 
|
Line 537: Line 520:
 
|
 
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | AlGaN
+
! bgcolor="#D0E7FF" align="center" | W-TiW
  +
|
  +
|
  +
|
  +
|
  +
|
  +
| {{rl|ICP Etching Recipes|W-TiW Etch(Panasonic 1)}}
  +
| A
  +
|
  +
|
  +
|
  +
|
  +
|
  +
|
  +
|
  +
|
  +
|- bgcolor="#EEFFFF"
  +
! bgcolor="#D0E7FF" align="center" | ZnO<sub>2</sub>
  +
|
 
|
 
|
 
|
 
|
Line 545: Line 546:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
 
|
 
|
 
|
 
|
Line 554: Line 554:
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | AlN
+
! bgcolor="#D0E7FF" align="center" | ZrO<sub>2</sub>
  +
|
 
|
 
|
 
|
 
|
Line 562: Line 563:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
 
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
|
 
 
|
 
|
 
|
 
|
  +
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
 
|-
 
|-
Line 605: Line 605:
 
|
 
|
 
|
 
|
  +
|- bgcolor="#EEFFFF"
|-
 
! bgcolor="#D0E7FF" align="center" | ZnS
+
! bgcolor="#D0E7FF" align="center" | Si
 
|
 
|
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
 
|
 
|
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|Si Etch (PlasmaTherm/Bosch Etch)}}
 
|
 
|
 
|
 
|
Line 619: Line 619:
 
|
 
|
 
|
 
|
  +
| {{rl|Other Dry Etching Recipes|Other Dry Etch (XeF2 Etcher)}}
 
|
 
|
|
 
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | ZnSe
+
! bgcolor="#D0E7FF" align="center" | SiC
|
 
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
 
|
 
|
 
|
 
|
Line 631: Line 629:
 
|
 
|
 
|
 
|
  +
| {{rl|ICP Etching Recipes|SiC Etch(Panasonic 1)}}
  +
| A
 
|
 
|
 
|
 
|
Line 640: Line 640:
 
|
 
|
 
|- bgcolor="#EEFFFF"
 
|- bgcolor="#EEFFFF"
! bgcolor="#D0E7FF" align="center" | Si
+
! bgcolor="#D0E7FF" align="center" | Sapphire
 
|
 
|
 
|
 
|
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|Si Etch (PlasmaTherm/Bosch Etch)}}
 
 
|
 
|
  +
| {{rl|ICP Etching Recipes|Sapphire Etch(Panasonic 1)}}
  +
| A
 
|
 
|
 
|
 
|
Line 652: Line 653:
 
|
 
|
 
|
 
|
|
+
|
| {{rl|Other Dry Etching Recipes|Other Dry Etch (XeF2 Etcher)}}
 
 
|
 
|
 
|
 
|
 
|-
 
|-
! bgcolor="#D0E7FF" align="center" | SiC
+
! bgcolor="#D0E7FF" align="center" | ZnS
  +
|
  +
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|
 
|
 
|
 
|
Line 663: Line 665:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|SiC Etch(Panasonic 1)}}
 
| A
 
 
|
 
|
 
|
 
|
Line 673: Line 673:
 
|
 
|
 
|
 
|
  +
|-
|- bgcolor="#EEFFFF"
 
! bgcolor="#D0E7FF" align="center" | Sapphire
+
! bgcolor="#D0E7FF" align="center" | ZnSe
  +
|
  +
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|
 
|
 
|
 
|
Line 680: Line 682:
 
|
 
|
 
|
 
|
| {{rl|ICP Etching Recipes|Sapphire Etch(Panasonic 1)}}
 
| A
 
 
|
 
|
 
|
 
|
Line 688: Line 688:
 
|
 
|
 
|
 
|
|
+
|
 
|
 
|
 
|-
 
|-

Revision as of 13:59, 22 September 2017