Difference between revisions of "Dry Etching Recipes"

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{{Recipe Table Explanation}}
  
{{Recipe Table Explanation}}
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! width="725" height="45" colspan="16" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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! colspan="16" width="725" height="45" | <div style="font-size: 150%;">Dry Etching Recipes</div>
 
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! width="300" bgcolor="#D0E7FF" align="center" height="35" colspan="4" | '''[[RIE Etching Recipes|RIE Etching]]'''
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! colspan="4" width="300" bgcolor="#D0E7FF" align="center" height="35" | '''[[RIE Etching Recipes|RIE Etching]]'''
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! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
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! colspan="4" width="300" bgcolor="#D0E7FF" align="center" | '''[[ICP Etching Recipes|ICP Etching]]'''
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! bgcolor="#D0E7FF" align="center" colspan="4"|'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="4" bgcolor="#D0E7FF" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! bgcolor="#D0E7FF" align="center" colspan="3" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
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! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
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! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
 
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| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
  
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
 
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
  
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
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Revision as of 13:52, 22 September 2017

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		Si Deep RIE
(PTI/Bosch) 		ICP Etch 1
(Panasonic 1) 		ICP Etch 2
(Panasonic 2) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag
Al A R R
Au R
Cr A R A
Cu
Ge
Ni R
Pt R
Ti R A
Ru
Mo
Ta
W-TiW R A
Al2O3
HfO2
ITO R
SiO2 R R R R
SiN R R R
SiOxNy
Ta2O5
TiO2
TiN
ZnO2
ZrO2
GaAs R R R R
AlGaAs R R R
InGaAlAs R R
InGaAsP R R
InP R R
GaN R R R
AlGaN R
AlN R
GaSb R
CdZnTe R
ZnS R
ZnSe R
Si R R
SiC R A
Sapphire R A
Material RIE 1
(Retired) 		RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		Si Deep RIE
(PlasmaTherm/Bosch Etch) 		ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Dry_Etching_Recipes&oldid=154444"