Difference between revisions of "Dry Etching Recipes"

Revision as of 13:44, 16 March 2018

R = Recipe is available. Clicking this link will take you to the recipe.

A = Material is available for use, but no recipes are provided.

Dry Etching Recipes
	RIE Etching				ICP Etching					Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A			R	R
Au																R
Cr				A			R	A
Cu
Ge														A
Mo
Ni																R
Pt																R
Ru
Si					R	R								R
Ta
Ti							R	A
Al₂O₃
Al₂O_{3 (Sapphire)}							R	A
AlGaAs				R			R		R
AlGaN									R
AlN									R
CdZnTe		R
GaAs				R			R	R	R
GaN				R			R		R
GaSb								A	R
HfO₂
InGaAlAs		R							R
InGaAsP		R							R
InP		R					A	A	R
ITO		R
Photoresist & ARC			A	A			A	R		A	A
SiC							R	A
SiN			R				R	R		A
SiO₂			R				R	R							R
SiOxNy
Ta₂O₅								A
TiN
TiO₂
W-TiW							R	A
ZnO₂
ZnS		R
ZnSe		R
ZrO₂
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	DSEIII (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

Difference between revisions of "Dry Etching Recipes"

Revision as of 13:44, 16 March 2018

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@@ Line 1: / Line 1: @@
 {{Recipe Table Explanation}}
-{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
+{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
-|- bgcolor="#D0E7FF"
+|- bgcolor="#d0e7ff"
-! colspan="17" width="725" height="45" | <div style="font-size: 150%;">Dry Etching Recipes</div>
+! width="725" height="45" colspan="17" | <div style="font-size: 150%;">Dry Etching Recipes</div>
-|- bgcolor="#D0E7FF"
+|- bgcolor="#d0e7ff"
 | <!-- INTENTIONALLY LEFT BLANK -->
-! colspan="4" width="300" bgcolor="#D0E7FF" align="center" height="35" | '''[[RIE Etching Recipes|RIE Etching]]'''
+! width="300" height="35" align="center" bgcolor="#d0e7ff" colspan="4" | '''[[RIE Etching Recipes|RIE Etching]]'''
 ! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
-! colspan="4" bgcolor="#D0E7FF" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
+! align="center" bgcolor="#d0e7ff" colspan="4" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
-! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
+! align="center" bgcolor="#d0e7ff" colspan="3" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 |-
-! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
+! width="65" align="center" bgcolor="#d0e7ff" | '''Material'''
-| width="65" bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
+| width="65" bgcolor="#daf1ff" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
-| width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+| width="65" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
-| width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+| width="65" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
-| width="100" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+| width="100" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
-| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
-| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
+| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
-| width="120" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
+| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
-| width="120" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
+| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
-| width="85" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+| width="85" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
-| width="85" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
-| width="95" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+| width="95" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
-| width="85" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
-| width="85" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
-| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
-| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
+| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
-| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
+| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Ag
+! align="center" bgcolor="#d0e7ff" | Ag
 |
 |
@@ Line 45: / Line 45: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Al
+! align="center" bgcolor="#d0e7ff" | Al
 |
 |
@@ Line 63: / Line 63: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Au
+! align="center" bgcolor="#d0e7ff" | Au
 |
 |
@@ Line 81: / Line 81: @@
 |
 |{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Cr
+! align="center" bgcolor="#d0e7ff" | Cr
 |
 |
@@ Line 99: / Line 99: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Cu
+! align="center" bgcolor="#d0e7ff" | Cu
 |
 |
@@ Line 118: / Line 118: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | Ge
+! align="center" bgcolor="#d0e7ff" | Ge
 |
 |
@@ Line 135: / Line 135: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Mo
+! align="center" bgcolor="#d0e7ff" | Mo
 |
 |
@@ Line 154: / Line 154: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | Ni
+! align="center" bgcolor="#d0e7ff" | Ni
 |
 |
@@ Line 172: / Line 172: @@
 |{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 |-
-! bgcolor="#D0E7FF" align="center" | Pt
+! align="center" bgcolor="#d0e7ff" | Pt
 |
 |
@@ Line 190: / Line 190: @@
 |{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 |-
-! bgcolor="#D0E7FF" align="center" | Ru
+! align="center" bgcolor="#d0e7ff" | Ru
 |
 |
@@ Line 207: / Line 207: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Si
+! align="center" bgcolor="#d0e7ff" | Si
 |
 |
@@ Line 226: / Line 226: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | Ta
+! align="center" bgcolor="#d0e7ff" | Ta
 |
 |
@@ Line 244: / Line 244: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | Ti
+! align="center" bgcolor="#d0e7ff" | Ti
 |
 |
@@ Line 262: / Line 262: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | Al<sub>2</sub>O<sub>3</sub>
+! align="center" bgcolor="#d0e7ff" | Al<sub>2</sub>O<sub>3</sub>
 |
 |
@@ Line 279: / Line 279: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
+! align="center" bgcolor="#d0e7ff" | Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
 |
 |
@@ Line 298: / Line 298: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | AlGaAs
+! align="center" bgcolor="#d0e7ff" | AlGaAs
 |
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@@ Line 315: / Line 315: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | AlGaN
+! align="center" bgcolor="#d0e7ff" | AlGaN
 |
 |
@@ Line 334: / Line 334: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | AlN
+! align="center" bgcolor="#d0e7ff" | AlN
 |
 |
@@ Line 351: / Line 351: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | CdZnTe
+! align="center" bgcolor="#d0e7ff" | CdZnTe
 |
 | {{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
@@ Line 369: / Line 369: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | GaAs
+! align="center" bgcolor="#d0e7ff" | GaAs
 |
 |
@@ Line 388: / Line 388: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | GaN
+! align="center" bgcolor="#d0e7ff" | GaN
 |
 |
@@ Line 405: / Line 405: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | GaSb
+! align="center" bgcolor="#d0e7ff" | GaSb
 |
 |
@@ Line 423: / Line 423: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | HfO<sub>2</sub>
+! align="center" bgcolor="#d0e7ff" | HfO<sub>2</sub>
 |
 |
@@ Line 441: / Line 441: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | InGaAlAs
+! align="center" bgcolor="#d0e7ff" | InGaAlAs
 |
 | {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
@@ Line 460: / Line 460: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | InGaAsP
+! align="center" bgcolor="#d0e7ff" | InGaAsP
 |
 | {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
@@ Line 477: / Line 477: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | InP
+! align="center" bgcolor="#d0e7ff" | InP
 |
 | {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
@@ Line 496: / Line 496: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | ITO
+! align="center" bgcolor="#d0e7ff" | ITO
 |
 | {{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
@@ Line 513: / Line 513: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
 !Photoresist
 & ARC
@@ Line 523: / Line 523: @@
 |
 |A
+|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching R]
-|A
 |
 |A
@@ Line 533: / Line 533: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | SiC
+! align="center" bgcolor="#d0e7ff" | SiC
 |
 |
@@ Line 551: / Line 551: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | SiN
+! align="center" bgcolor="#d0e7ff" | SiN
 |
 |
@@ Line 568: / Line 568: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | SiO<sub>2</sub>
+! align="center" bgcolor="#d0e7ff" | SiO<sub>2</sub>
 |
 |
@@ Line 586: / Line 586: @@
 | {{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | SiOxNy
+! align="center" bgcolor="#d0e7ff" | SiOxNy
 |
 |
@@ Line 605: / Line 605: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | Ta<sub>2</sub>O<sub>5</sub>
+! align="center" bgcolor="#d0e7ff" | Ta<sub>2</sub>O<sub>5</sub>
 |
 |
@@ Line 623: / Line 623: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | TiN
+! align="center" bgcolor="#d0e7ff" | TiN
 |
 |
@@ Line 640: / Line 640: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | TiO<sub>2</sub>
+! align="center" bgcolor="#d0e7ff" | TiO<sub>2</sub>
 |
 |
@@ Line 658: / Line 658: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | W-TiW
+! align="center" bgcolor="#d0e7ff" | W-TiW
 |
 |
@@ Line 676: / Line 676: @@
 |
 |
-|- bgcolor="#EEFFFF"
+|- bgcolor="#eeffff"
-! bgcolor="#D0E7FF" align="center" | ZnO<sub>2</sub>
+! align="center" bgcolor="#d0e7ff" | ZnO<sub>2</sub>
 |
 |
@@ Line 695: / Line 695: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | ZnS
+! align="center" bgcolor="#d0e7ff" | ZnS
 |
 | {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
@@ Line 713: / Line 713: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | ZnSe
+! align="center" bgcolor="#d0e7ff" | ZnSe
 |
 | {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
@@ Line 731: / Line 731: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | ZrO<sub>2</sub>
+! align="center" bgcolor="#d0e7ff" | ZrO<sub>2</sub>
 |
 |
@@ Line 749: / Line 749: @@
 |
 |-
-! bgcolor="#D0E7FF" align="center" | '''Material'''
+! align="center" bgcolor="#d0e7ff" | '''Material'''
-| bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
+| bgcolor="#daf1ff" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
-| bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
-| bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
-| bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
-| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
-| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]
+| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]
-| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
+| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
-| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
+| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
-| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
-| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
-| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
-| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
-| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
-| bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
-| bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
+| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
-| bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
+| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
 |}