Difference between revisions of "Dry Etching Recipes"

Revision as of 14:16, 22 September 2017

R = Recipe is available. Clicking this link will take you to the recipe.

Dry Etching Recipes
	RIE Etching				ICP Etching				Oxygen Plasma Systems				Other Dry Etchers
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PTI/Bosch)	ICP Etch 1 (Panasonic 1)	ICP Etch 2 (Panasonic 2)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)
Ag
Al				A		R	R
Au															R
Cr				A		R	A
Cu
Ge
Mo
Ni															R
Pt															R
Ru
Si					R								R
Ta
Ti						R	A
Al₂O₃
Al₂O_{3 (Sapphire)}						R	A
AlGaAs				R		R		R
AlGaN								R
AlN								R
CdZnTe		R
GaAs				R		R	R	R
GaN				R		R		R
GaSb								R
HfO₂
InGaAlAs		R						R
InGaAsP		R						R
InP		R						R
ITO		R
SiC						R	A
SiN			R			R	R
SiO₂			R			R	R							R
SiOxNy
Ta₂O₅							A
TiN
TiO₂
W-TiW						R	A
ZnO₂
ZnS		R
ZnSe		R
ZrO₂
Material	RIE 1 (Retired)	RIE 2 (MRC)	RIE 3 (MRC)	RIE 5 (PlasmaTherm)	Si Deep RIE (PlasmaTherm/Bosch Etch)	ICP Etch 1 (Panasonic E626I)	ICP Etch 2 (Panasonic E640)	ICP-Etch (Unaxis VLR)	Ashers (Technics PEII)	Plasma Clean (Gasonics 2000)	UV Ozone Reactor	Plasma Activation (EVG 810)	XeF2 Etch (Xetch)	Vapor HF Etch (uETCH)	CAIBE (Oxford)

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