Difference between revisions of "Dry Etching Recipes"

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{{Recipe Table Explanation}}
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===<u>[[Process Group - Process Control Data#Etching .28Process Control Data.29|Process Control Data]]</u>===
{| border="1" class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
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<small>''See [[Process Group - Process Control Data#Etching .28Process Control Data.29|linked page]] for [https://en.wikipedia.org/wiki/Statistical_process_control process control data] (dep rate/stress etc. over time), for a selection of often-used thin-film depositions.''</small>
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! width="725" height="45" colspan="15" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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===Dry Etching Tools/Materials Table===
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| <!-- INTENTIONALLY LEFT BLANK -->  
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*<small>'''R''': ''Recipe is available. Clicking this link will take you to the recipe.''</small>
! width="300" bgcolor="#D0E7FF" align="center" height="35" colspan="4" | '''[[RIE Etching Recipes|RIE Etching]]'''  
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*<small>'''A''': ''Material is available for use, but no recipes are provided.''</small>
! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
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! bgcolor="#D0E7FF" align="center" colspan="4"|'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
! bgcolor="#D0E7FF" align="center"|'''[[Other Dry Etcher Recipes|Other Dry Etchers]]'''
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|-  
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! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
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|- bgcolor="#d0e7ff"
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| bgcolor="#eaecf0" | <!-- INTENTIONALLY LEFT BLANK -->
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! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
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! colspan="6" |'''[[ICP Etching Recipes|ICP Etching]]'''
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! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
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|- bgcolor="#d0e7ff"
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! bgcolor="#d0e7ff" align="center" |'''Material'''
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
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| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
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| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br><span style="font-size: 88%;">(Unaxis VLR)</span>]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
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| bgcolor="#daf1ff" |
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| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
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! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
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!Nb
| width="65" bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Custom)]]
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| width="65" bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]]
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| width="65" bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]]
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| width="100" bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]]
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| width="160" bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]
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| width="120" bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]]
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| width="120" bgcolor="#DAF1FF" | [[ICP Etch 2 (Panasonic E640)|ICP Etch 2<br>(Panasonic E640)]]
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| width="85" bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]]
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| width="85" bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]]
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| width="95" bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]]
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| width="85" bgcolor="#DAF1FF" | [[UV Ozone Reactor]]
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| width="85" bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
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| width="85" bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
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|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
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! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub>
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|[https://wiki.nanotech.ucsb.edu/w/index.php?title=ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
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|{{rl|RIE Etching Recipes|AlGaAs\GaAs Etching (RIE 5)}}
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|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
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|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R]]
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
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|{{rl|ICP Etching Recipes|GaAs-AlGaAs_Etch_.28Panasonic_1.29}}
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|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
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|[[ICP Etching Recipes#GaAs Etch .28Oxford ICP Etcher.29|R]]
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|{{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
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|[[ICP Etching Recipes#GaN Etch .28Oxford ICP Etcher.29|R]]
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R]]
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
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! bgcolor="#d0e7ff" align="center" |InP
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R]]
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
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|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_.26_ARC_.28Fluorine_ICP_Etcher.29 R]
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! bgcolor="#d0e7ff" align="center" |'''Material'''
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
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| bgcolor="#daf1ff" |[[ICP Etching Recipes#PlasmaTherm.2FSLR Fluorine Etcher|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
|-
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
! bgcolor="#D0E7FF" align="center" | AlGaAs
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
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! bgcolor="#D0E7FF" align="center" | '''Material'''
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
| bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Custom)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
| bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]]  
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
| bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]]  
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
| bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
| bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]  
 
| bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]]
 
| bgcolor="#DAF1FF" | [[ICP Etch 2 (Panasonic E640)|ICP Etch 2<br>(Panasonic E640)]]  
 
| bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]]
 
| bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]]
 
| bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]]
 
| bgcolor="#DAF1FF" | [[UV Ozone Reactor]]
 
| bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
 
| bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]  
 
 
|}
 
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[[Category:Processing]]

Latest revision as of 16:54, 29 September 2022

Process Control Data

See linked page for process control data (dep rate/stress etc. over time), for a selection of often-used thin-film depositions.

Dry Etching Tools/Materials Table

  • R: Recipe is available. Clicking this link will take you to the recipe.
  • A: Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A A A
Mo A
Nb A A
Ni R
Os A A
Pt R
Ru A R A
Si R R A R A
Ta A A A
Ti R A A
Al2O3 A R A
Al2O3 (Sapphire) R A A
AlGaAs R R R R A
AlGaN R R A
AlN R A
BCB A
CdZnTe R A
GaAs R R R R R A
GaN R R A R R A
GaSb A A A R A
HfO2 A
InGaAlAs R A R A
InGaAsP R R R A
InP R A A R R R
ITO R A
LiNbO3 A
Photoresist

& ARC

A R R R R R R A
Ru A R
SiC R A A
SiN R A R R A A
SiO2 R R R R R A
SiOxNy A A A
SU8 A
Ta2O5 A A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)