Difference between revisions of "Dry Etching Recipes"

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(link to Oxford InP/PnGaAsP recipes)
 
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{{Recipe Table Explanation}}
 
{{Recipe Table Explanation}}
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
! width="725" height="45" colspan="15" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
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! width="300" bgcolor="#D0E7FF" align="center" height="35" colspan="4" | '''[[RIE Etching Recipes|RIE Etching]]'''  
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|<!-- INTENTIONALLY LEFT BLANK -->
! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
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! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
! bgcolor="#D0E7FF" align="center" colspan="4"|'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="6" |'''[[ICP Etching Recipes|ICP Etching]]'''
! bgcolor="#D0E7FF" align="center"|'''[[Other Dry Etcher Recipes|Other Dry Etchers]]'''
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! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
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! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''  
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! bgcolor="#d0e7ff" align="center" |'''Material'''
| width="65" bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Custom)]]  
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
| width="65" bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]]  
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
| width="65" bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]]  
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| width="100" bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]]  
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| width="160" bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]  
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| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
| width="120" bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]]  
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
| width="120" bgcolor="#DAF1FF" | [[ICP Etch 2 (Panasonic E640)|ICP Etch 2<br>(Panasonic E640)]]  
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
| width="85" bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]]  
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| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
| width="85" bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br><span style="font-size: 88%;">(Unaxis VLR)</span>]]
| width="95" bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
| width="85" bgcolor="#DAF1FF" | [[UV Ozone Reactor]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br><span style="font-size: 88%;">(Gasonics 2000)</span>]]
| width="85" bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
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| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
| width="85" bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
|-bgcolor ="#EEFFFF"
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
! bgcolor="#D0E7FF" align="center" | Al
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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! bgcolor="#D0E7FF" align="center" | GaSb
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|[[ICP Etching Recipes#InP Ridge Etch .28Oxford ICP Etcher.29|R]]
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! bgcolor="#D0E7FF" align="center" | CdTe
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
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!Photoresist
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& ARC
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|[https://wiki.nanotech.ucsb.edu/wiki/RIE_Etching_Recipes#Photoresist_and_ARC_.28RIE_5.29 R]
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|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_.26_ARC_.28Fluorine_ICP_Etcher.29 R]
|-
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|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_Etching_.28Panasonic_1.29 R]
! bgcolor="#D0E7FF" align="center" | SiC
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|[https://wiki.nanotech.ucsb.edu/wiki/ICP_Etching_Recipes#Photoresist_and_ARC_etching_.28Panasonic_2.29 R]
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|{{rl|ICP Etching Recipes|SiO2 Etching (Fluorine ICP Etcher)}}
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! bgcolor="#D0E7FF" align="center" | '''Material'''  
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|- bgcolor="#eeffff"
| bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Custom)]]  
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! bgcolor="#d0e7ff" align="center" |'''Material'''
| bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]]  
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]]  
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> <span style="font-size: 88%;">(MRC)</span>]]
| bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]]  
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]  
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br><span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]]  
+
| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP <span style="font-size: 88%;">(PlasmaTherm)</span>]]
| bgcolor="#DAF1FF" | [[ICP Etch 2 (Panasonic E640)|ICP Etch 2<br>(Panasonic E640)]]  
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br><span style="font-size: 88%;">(Panasonic E626I)</span>]]
| bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]]  
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br><span style="font-size: 88%;">(Panasonic E640)</span>]]
| bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]]
+
| bgcolor="#daf1ff" |[[ICP Etching Recipes#Oxford ICP Etcher .28PlasmaPro 100 Cobra.29|Oxford ICP <span style="font-size: 88%;">(PlasmaPro 100)</span>]]
| bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br><span style="font-size: 88%;">(Unaxis VLR)</span>]]
| bgcolor="#DAF1FF" | [[UV Ozone Reactor]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br><span style="font-size: 88%;">(Technics PEII)</span>]]
| bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br><span style="font-size: 88%;">(Gasonics 2000)</span>]]
| bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]  
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| bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean <span style="font-size: 88%;">(YES EcoClean)</span>]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br><span style="font-size: 88%;">(EVG 810)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br><span style="font-size: 88%;">(Xetch)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br><span style="font-size: 88%;">(uETCH)</span>]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br><span style="font-size: 88%;">(Oxford)</span>]]
 
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[[Category:Processing]]

Latest revision as of 12:53, 8 October 2021

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A
Mo A
Ni R
Pt R
Ru A R A
Si R R A R A
Ta A
Ti R A A
Al2O3 R A
Al2O3 (Sapphire) R A A
AlGaAs R R A R A
AlGaN A R A
AlN R A
CdZnTe R A
GaAs R R R A R A
GaN R R A R A
GaSb A R A
HfO2 A
InGaAlAs R A R A
InGaAsP R R R A
InP R A A R R R
ITO R A
Photoresist

& ARC

A R R R R A A A A
SiC R A A
SiN R A R R A A
SiO2 R R R R R A
SiOxNy A A A
Ta2O5 A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)