Difference between revisions of "Dry Etching Recipes"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Line 329: Line 329:
 
|
 
|
 
|
 
|
  +
|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
|
 
 
|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
 
|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
 
|{{rl|ICP Etching Recipes|GaAs Etch (Unaxis VLR)}}
 
|{{rl|ICP Etching Recipes|GaAs Etch (Unaxis VLR)}}

Revision as of 16:15, 23 October 2013

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Custom)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
Si Deep RIE
(PlasmaTherm/Bosch Etch)
ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Al R R
Ti R A
Cr A R A
Ge
Ag
Ru
Mo
Ta
W-TiW R A
Al2O3
HfO2
ITo
SiO2 R R
SiN R R
SiOxNy
Ta2O5
TiO2
TiN
ZnO2
ZrO2
GaAs R R R
AlGaAs R R R
InGaAlAs
InGaAsP
InP R R
GaN R R R
AlGaN
AlN
GaN
AlGaN
AlN
GaSb
CdZnTe R
ZnSe
Si R R
SiC
Sapphire
Material RIE 1
(Custom)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
Si Deep RIE
(PlasmaTherm/Bosch Etch)
ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)