Difference between revisions of "Dry Etching Recipes"
Jump to navigation
Jump to search
(minor change) |
|||
(7 intermediate revisions by 4 users not shown) | |||
Line 2: | Line 2: | ||
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1" |
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1" |
||
|- bgcolor="#d0e7ff" |
|- bgcolor="#d0e7ff" |
||
− | ! colspan=" |
+ | ! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div> |
|- bgcolor="#d0e7ff" |
|- bgcolor="#d0e7ff" |
||
|<!-- INTENTIONALLY LEFT BLANK --> |
|<!-- INTENTIONALLY LEFT BLANK --> |
||
− | ! colspan=" |
+ | ! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]''' |
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]''' |
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]''' |
||
− | ! colspan="5" |
+ | ! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]''' |
− | ! colspan="3" |
+ | ! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]''' |
|- |
|- |
||
− | ! width="65" |
+ | ! width="65" bgcolor="#d0e7ff" align="center" |'''Material''' |
− | | width="65" bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]] |
||
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]] |
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]] |
||
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]] |
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]] |
||
| width="100" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]] |
| width="100" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]] |
||
| width="100" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]] |
| width="100" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]] |
||
− | | width="100" bgcolor="#daf1ff" |[https:// |
+ | | width="100" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher SLR Fluorine ICP (PlasmaTherm)] |
| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]] |
| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]] |
||
| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]] |
| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]] |
||
Line 29: | Line 28: | ||
| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]] |
| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]] |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Ag |
− | | |
||
| |
| |
||
| |
| |
||
Line 48: | Line 46: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Al |
− | | |
||
| |
| |
||
| |
| |
||
Line 67: | Line 64: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Au |
| |
| |
||
| |
| |
||
Line 83: | Line 80: | ||
| |
| |
||
| |
| |
||
+ | |{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}} |
||
− | | |
||
⚫ | |||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Cr |
− | | |
||
| |
| |
||
| |
| |
||
Line 105: | Line 100: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Cu |
− | | |
||
| |
| |
||
| |
| |
||
Line 124: | Line 118: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Ge |
− | | |
||
| |
| |
||
| |
| |
||
Line 143: | Line 136: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Mo |
− | | |
||
| |
| |
||
| |
| |
||
Line 162: | Line 154: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Ni |
− | | |
||
| |
| |
||
| |
| |
||
Line 181: | Line 172: | ||
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}} |
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}} |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Pt |
− | | |
||
| |
| |
||
| |
| |
||
Line 200: | Line 190: | ||
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}} |
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}} |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Ru |
− | | |
||
| |
| |
||
| |
| |
||
Line 219: | Line 208: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Si |
− | | |
||
| |
| |
||
| |
| |
||
Line 238: | Line 226: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Ta |
− | | |
||
| |
| |
||
| |
| |
||
Line 257: | Line 244: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Ti |
− | | |
||
| |
| |
||
| |
| |
||
Line 276: | Line 262: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub> |
| |
| |
||
| |
| |
||
Line 283: | Line 269: | ||
| |
| |
||
| |
| |
||
⚫ | |||
− | | |
||
− | |[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R] |
||
| |
| |
||
| |
| |
||
Line 295: | Line 280: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub> |
− | | |
||
| |
| |
||
| |
| |
||
Line 314: | Line 298: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |AlGaAs |
− | | |
||
| |
| |
||
| |
| |
||
Line 333: | Line 316: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |AlGaN |
− | | |
||
| |
| |
||
| |
| |
||
Line 352: | Line 334: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |AlN |
− | | |
||
| |
| |
||
| |
| |
||
Line 371: | Line 352: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |CdZnTe |
− | | |
||
|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}} |
|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}} |
||
| |
| |
||
Line 390: | Line 370: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |GaAs |
− | | |
||
| |
| |
||
| |
| |
||
Line 409: | Line 388: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |GaN |
− | | |
||
| |
| |
||
| |
| |
||
Line 428: | Line 406: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |GaSb |
− | | |
||
| |
| |
||
| |
| |
||
Line 447: | Line 424: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |HfO<sub>2</sub> |
− | | |
||
| |
| |
||
| |
| |
||
Line 466: | Line 442: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |InGaAlAs |
− | | |
||
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}} |
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}} |
||
| |
| |
||
Line 485: | Line 460: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |InGaAsP |
− | | |
||
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}} |
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}} |
||
| |
| |
||
Line 504: | Line 478: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |InP |
− | | |
||
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}} |
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}} |
||
| |
| |
||
Line 521: | Line 494: | ||
| |
| |
||
| |
| |
||
+ | |{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}} |
||
− | |A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |ITO |
− | | |
||
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}} |
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}} |
||
| |
| |
||
Line 544: | Line 516: | ||
!Photoresist |
!Photoresist |
||
& ARC |
& ARC |
||
− | | |
||
| |
| |
||
|A |
|A |
||
− | |[https:// |
+ | |[https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#Photoresist_and_ARC R] |
| |
| |
||
| |
| |
||
− | |[https:// |
+ | |[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_Etching R] |
− | |[https:// |
+ | |[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching_2 R] |
| |
| |
||
|A |
|A |
||
Line 562: | Line 533: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |SiC |
− | | |
||
| |
| |
||
| |
| |
||
Line 581: | Line 551: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |SiN |
− | | |
||
| |
| |
||
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}} |
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}} |
||
Line 600: | Line 569: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub> |
− | | |
||
| |
| |
||
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}} |
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}} |
||
| |
| |
||
| |
| |
||
+ | |{{rl|ICP Etching Recipes|SiO2 Etching (Fluorine ICP Etcher)}} |
||
− | |A |
||
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}} |
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}} |
||
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}} |
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}} |
||
Line 619: | Line 587: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |SiOxNy |
− | | |
||
| |
| |
||
| |
| |
||
Line 638: | Line 605: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |Ta<sub>2</sub>O<sub>5</sub> |
− | | |
||
| |
| |
||
| |
| |
||
Line 657: | Line 623: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |TiN |
− | | |
||
| |
| |
||
| |
| |
||
Line 676: | Line 641: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |TiO<sub>2</sub> |
− | | |
||
| |
| |
||
| |
| |
||
Line 695: | Line 659: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |W-TiW |
− | | |
||
| |
| |
||
| |
| |
||
Line 714: | Line 677: | ||
|A |
|A |
||
|- bgcolor="#eeffff" |
|- bgcolor="#eeffff" |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |ZnO<sub>2</sub> |
− | | |
||
| |
| |
||
| |
| |
||
Line 733: | Line 695: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |ZnS |
− | | |
||
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}} |
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}} |
||
| |
| |
||
Line 752: | Line 713: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |ZnSe |
− | | |
||
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}} |
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}} |
||
| |
| |
||
Line 771: | Line 731: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |ZrO<sub>2</sub> |
− | | |
||
| |
| |
||
| |
| |
||
Line 790: | Line 749: | ||
|A |
|A |
||
|- |
|- |
||
− | ! |
+ | ! bgcolor="#d0e7ff" align="center" |'''Material''' |
− | | bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]] |
||
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]] |
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]] |
||
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]] |
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]] |
Revision as of 16:32, 4 February 2021
- R = Recipe is available. Clicking this link will take you to the recipe.
- A = Material is available for use, but no recipes are provided.