Difference between revisions of "Dry Etching Recipes"

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(fixed CAIBE recipe link)
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
 
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! colspan="17" width="725" height="45" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 
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! colspan="4" width="300" height="35" align="center" bgcolor="#d0e7ff" | '''[[RIE Etching Recipes|RIE Etching]]'''
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! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
 
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
 
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="4" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! colspan="3" align="center" bgcolor="#d0e7ff" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
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! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
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! width="65" align="center" bgcolor="#d0e7ff" | '''Material'''
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! width="65" bgcolor="#d0e7ff" align="center" |'''Material'''
| width="65" bgcolor="#daf1ff" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
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| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| width="65" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
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| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| width="65" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
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| width="100" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
| width="100" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
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| width="100" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
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| width="100" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher SLR Fluorine ICP (PlasmaTherm)]
| width="100" bgcolor="#daf1ff" | [[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
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| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
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| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
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| width="85" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
| width="85" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
| width="95" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
 
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| [[RIE Etching Recipes|A]]
 
 
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| {{rl|ICP Etching Recipes|Al Etch (Panasonic 1)}}
 
| {{rl|ICP Etching Recipes|Al Etch (Panasonic 2)}}
 
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|[https://www.nanotech.ucsb.edu/wiki/index.php/Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29 A]
 
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
 
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! align="center" bgcolor="#d0e7ff" | InGaAlAs
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! bgcolor="#d0e7ff" align="center" |InGaAlAs
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
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! bgcolor="#d0e7ff" align="center" |InGaAsP
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
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| {{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
 
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|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
! align="center" bgcolor="#d0e7ff" | InP
+
! bgcolor="#d0e7ff" align="center" |InP
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|-
 
|-
! align="center" bgcolor="#d0e7ff" | ITO
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! bgcolor="#d0e7ff" align="center" |ITO
  +
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
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| {{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 
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!Photoresist
 
!Photoresist
 
& ARC
 
& ARC
 
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#Photoresist_and_ARC R]
 
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_Etching R]
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching_2 R]
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|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching R]
 
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|{{rl|ICP Etching Recipes|SiC Etch (Panasonic 1)}}
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Line 532: Line 546:
 
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|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
 
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| {{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
 
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|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
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|{{rl|ICP Etching Recipes|SiO2 Etching (Fluorine ICP Etcher)}}
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|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
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|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
 
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|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
 
|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
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! bgcolor="#d0e7ff" align="center" |W-TiW
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| {{rl|ICP Etching Recipes|W-TiW Etch (Panasonic 1)}}
 
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! align="center" bgcolor="#d0e7ff" | ZnO<sub>2</sub>
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! align="center" bgcolor="#d0e7ff" | ZnS
+
! bgcolor="#d0e7ff" align="center" |ZnS
  +
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
|
 
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
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! align="center" bgcolor="#d0e7ff" | ZnSe
+
! bgcolor="#d0e7ff" align="center" |ZnSe
  +
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
|
 
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
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|-
! align="center" bgcolor="#d0e7ff" | ZrO<sub>2</sub>
+
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|-
 
|-
! align="center" bgcolor="#d0e7ff" | '''Material'''
+
! bgcolor="#d0e7ff" align="center" |'''Material'''
| bgcolor="#daf1ff" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
| bgcolor="#daf1ff" | [[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
+
| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+
| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+
| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
+
| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
 
|}
 
|}
   

Revision as of 16:32, 4 February 2021

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A
Mo A
Ni R
Pt R
Ru A R A
Si R R R A
Ta A
Ti R A A
Al2O3 R A
Al2O3 (Sapphire) R A A
AlGaAs R R R A
AlGaN R A
AlN R A
CdZnTe R A
GaAs R R R R A
GaN R R R A
GaSb A R A
HfO2 A
InGaAlAs R R A
InGaAsP R R A
InP R A A R R
ITO R A
Photoresist

& ARC

A R R R A A A A
SiC R A A
SiN R R R A A
SiO2 R R R R R A
SiOxNy A A A
Ta2O5 A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)