Difference between revisions of "Dry Etching Recipes"

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{{Recipe Table Explanation}}
  
{{Recipe Table Explanation}}
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! width="725" height="45" colspan="16" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
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! width="300" bgcolor="#D0E7FF" align="center" height="35" colspan="4" | '''[[RIE Etching Recipes|RIE Etching]]'''
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! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
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! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
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! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
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! bgcolor="#D0E7FF" align="center" colspan="4"|'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! bgcolor="#D0E7FF" align="center" colspan="3" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
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! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
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! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
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! width="65" bgcolor="#d0e7ff" align="center" |'''Material'''
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| width="65" bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Custom)]]
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| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
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| width="65" bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]]
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| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
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| width="65" bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]]
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| width="100" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
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| width="100" bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]]
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| width="100" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
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| width="100" bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PTI/Bosch)]]
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| width="100" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher SLR Fluorine ICP (PlasmaTherm)]
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| width="120" bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic 1)]]
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| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
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| width="120" bgcolor="#DAF1FF" | [[ICP Etch 2 (Panasonic E640)|ICP Etch 2<br>(Panasonic 2)]]
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| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
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| width="85" bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]]
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| width="85" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
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| width="85" bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
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| width="95" bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
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| width="85" bgcolor="#DAF1FF" | [[UV Ozone Reactor]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
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| width="85" bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
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| width="85" bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
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| width="85" bgcolor="#DAF1FF" | [[Vapor HF Etch|Vapor HF Etch<br>(uETCH)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
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| width="85" bgcolor="#DAF1FF" | [[CAIBE (Oxford Ion Mill)|CAIBE<br>(Oxford)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
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| bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Custom)]]
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
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| bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]]
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| bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
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| bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]
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| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
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| bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
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| bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
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| bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
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| bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
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| bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
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| bgcolor="#DAF1FF" | [[Vapor HF Etch|Vapor HF Etch<br>(uETCH)]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
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| bgcolor="#DAF1FF" | [[CAIBE (Oxford Ion Mill)|CAIBE<br>(Oxford)]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
 
|}
  
|}
   

Revision as of 16:32, 4 February 2021

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic 1) 		ICP Etch 2
(Panasonic 2) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A
Mo A
Ni R
Pt R
Ru A R A
Si R R R A
Ta A
Ti R A A
Al2O3 R A
Al2O3 (Sapphire) R A A
AlGaAs R R R A
AlGaN R A
AlN R A
CdZnTe R A
GaAs R R R R A
GaN R R R A
GaSb A R A
HfO2 A
InGaAlAs R R A
InGaAsP R R A
InP R A A R R
ITO R A
Photoresist

& ARC

A R R R A A A A
SiC R A A
SiN R R R A A
SiO2 R R R R R A
SiOxNy A A A
Ta2O5 A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC) 		RIE 3
(MRC) 		RIE 5
(PlasmaTherm) 		DSEIII
(PlasmaTherm) 		SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I) 		ICP Etch 2
(Panasonic E640) 		ICP-Etch
(Unaxis VLR) 		Ashers
(Technics PEII) 		Plasma Clean
(Gasonics 2000) 		Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810) 		XeF2 Etch
(Xetch) 		Vapor HF Etch
(uETCH) 		CAIBE
(Oxford)
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