Difference between revisions of "Dry Etching Recipes"

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{{Recipe Table Explanation}}
{| border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" class="collapsible wikitable"
 
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
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|- bgcolor="#d0e7ff"
! width="725" height="45" colspan="10" | <div style="font-size: 150%;">Dry Etching Recipes</div>
 
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! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
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|- bgcolor="#d0e7ff"
| <!-- INTENTIONALLY LEFT BLANK -->
 
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|<!-- INTENTIONALLY LEFT BLANK -->
! width="300" bgcolor="#D0E7FF" align="center" colspan="5" | '''[[RIE Etching Recipes|RIE Etching]]'''
 
! width="300" bgcolor="#D0E7FF" align="center" colspan="4" | '''[[ICP Etching Recipes|ICP Etching]]'''
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! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
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! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
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! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
|-
 
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! width="75" bgcolor="#D0E7FF" align="center" | '''Material'''
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! width="65" bgcolor="#d0e7ff" align="center" |'''Material'''
| bgcolor="#DAF1FF" | [[RIE 1 (Custom)]]
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| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| bgcolor="#DAF1FF" | [[RIE 2 (MRC)]]
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| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| bgcolor="#DAF1FF" | [[RIE 3 (MRC)]]
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| width="100" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
| bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)]]
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| width="100" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
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| width="100" bgcolor="#daf1ff" |[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#PlasmaTherm.2FSLR_Fluorine_Etcher SLR Fluorine ICP (PlasmaTherm)]
| bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
 
| bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)]]
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| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
| bgcolor="#DAF1FF" | [[ICP Etch 2 (Panasonic E640)]]
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| width="120" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
| bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)]]
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| width="85" bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
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| width="85" bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
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| width="85" bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
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! bgcolor="#d0e7ff" align="center" |Ag
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! bgcolor="#d0e7ff" align="center" |Al
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|[[RIE Etching Recipes|A]]
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|{{rl|ICP Etching Recipes|Al Etch (Panasonic 1)}}
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|{{rl|ICP Etching Recipes|Al Etch (Panasonic 2)}}
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
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! bgcolor="#d0e7ff" align="center" |Cr
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|{{rl|ICP Etching Recipes|Cr Etch (Panasonic 1)}}
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
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! width="100" bgcolor="#D0E7FF" align="center" | Cr
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! bgcolor="#d0e7ff" align="center" |Pt
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
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! width="100" bgcolor="#D0E7FF" align="center" | Ge
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! bgcolor="#d0e7ff" align="center" |Ru
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|{{Rl|ICP Etching Recipes|Ru (Ruthenium) Etch (Panasonic 2)}}
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! bgcolor="#d0e7ff" align="center" |Si
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|{{rl|ICP Etching Recipes|DSEIII_(PlasmaTherm/Deep_Silicon_Etcher)}}
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|{{Rl|ICP Etching Recipes|Si Etching}}
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (XeF2 Etcher)}}
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|A
 
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! width="100" bgcolor="#D0E7FF" align="center" | Ag
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! bgcolor="#d0e7ff" align="center" |Ta
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! width="100" bgcolor="#D0E7FF" align="center" | Ru
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! bgcolor="#d0e7ff" align="center" |Ti
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|{{rl|ICP Etching Recipes|Ti Etch (Panasonic 1)}}
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! width="100" bgcolor="#D0E7FF" align="center" | Mo
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! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3</sub>
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Al2O3_Etching_.28Panasonic_2.29 R]
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|- bgcolor="#eeffff"
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! bgcolor="#d0e7ff" align="center" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
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|
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|{{rl|ICP Etching Recipes|Sapphire Etch (Panasonic 1)}}
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|A
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|-
 
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! width="100" bgcolor="#D0E7FF" align="center" | Ta
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! bgcolor="#d0e7ff" align="center" |AlGaAs
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|{{rl|RIE Etching Recipes|AlGaAs\GaAs Etching (RIE 5)}}
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|{{rl|ICP Etching Recipes|AlGaAs Etch (Panasonic 1)}}
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|AlGaAs Etch (Unaxis VLR)}}
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! bgcolor="#d0e7ff" align="center" |AlGaN
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|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
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|A
 
|-
 
|-
! width="100" bgcolor="#D0E7FF" align="center" | W
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! bgcolor="#d0e7ff" align="center" |AlN
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|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
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|- bgcolor="#eeffff"
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! bgcolor="#d0e7ff" align="center" |CdZnTe
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|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
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|- bgcolor="#eeffff"
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! bgcolor="#d0e7ff" align="center" |GaAs
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|
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|{{rl|RIE Etching Recipes|AlGaAs\GaAs Etching (RIE 5)}}
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|{{rl|ICP Etching Recipes|GaAs-AlGaAs_Etch_.28Panasonic_1.29}}
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|{{rl|ICP Etching Recipes|GaAs Etch (Panasonic 2)}}
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaAs-AlGaAs Etch (Unaxis VLR)|GaAs Etch (Unaxis VLR)}}
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! width="100" bgcolor="#D0E7FF" align="center" | Al<sub>2</sub>O<sub>3</sub>
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! bgcolor="#d0e7ff" align="center" |GaN
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|{{rl|RIE Etching Recipes|GaN Etching (RIE 5)}}
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|{{rl|ICP Etching Recipes|GaN Etch (Panasonic 1)}}
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|{{rl|ICP Etching Recipes|GaN Etch (Unaxis VLR)}}
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! bgcolor="#d0e7ff" align="center" |GaSb
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|GaSb Etch Unaxis VLR)}}
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|- bgcolor="#eeffff"
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! bgcolor="#d0e7ff" align="center" |HfO<sub>2</sub>
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|- bgcolor="#eeffff"
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! bgcolor="#d0e7ff" align="center" |InGaAlAs
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
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! width="100" bgcolor="#D0E7FF" align="center" | HfO<sub>2</sub>
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! bgcolor="#d0e7ff" align="center" |InGaAsP
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
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|A
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|- bgcolor="#eeffff"
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! bgcolor="#d0e7ff" align="center" |InP
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|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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|A
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|{{rl|ICP Etching Recipes|ICP-Etch (Unaxis VLR)|InP-InGaAs-InAlAs Etch (Unaxis VLR)|InP Etch (Unaxis VLR)}}
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|-
 
|-
! width="100" bgcolor="#D0E7FF" align="center" | ITo
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! bgcolor="#d0e7ff" align="center" |ITO
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|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
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|- bgcolor="#eeffff"
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!Photoresist
  +
& ARC
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|
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|A
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#Photoresist_and_ARC R]
  +
|
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|
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_Etching R]
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|[https://wiki.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching_2 R]
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|
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|A
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|A
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|A
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|A
 
|-
 
|-
! width="100" bgcolor="#D0E7FF" align="center" | SiO<sub>2</sub>
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! bgcolor="#d0e7ff" align="center" |SiC
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|{{rl|ICP Etching Recipes|SiC Etch (Panasonic 1)}}
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|A
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|A
 
|-
 
|-
! width="100" bgcolor="#D0E7FF" align="center" | SiN
+
! bgcolor="#d0e7ff" align="center" |SiN
|
+
|
  +
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
|
 
|
+
|
|
+
|
|
+
|
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|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 1)}}
|
 
  +
|{{rl|ICP Etching Recipes|SiNx Etching (Panasonic 2)}}
|
 
|
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|A
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|
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|
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|
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|
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|A
  +
|- bgcolor="#eeffff"
  +
! bgcolor="#d0e7ff" align="center" |SiO<sub>2</sub>
  +
|
  +
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
  +
|
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|
  +
|{{rl|ICP Etching Recipes|SiO2 Etching (Fluorine ICP Etcher)}}
  +
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
  +
|{{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
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|
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|
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|
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|
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|
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
  +
|A
  +
|- bgcolor="#eeffff"
  +
! bgcolor="#d0e7ff" align="center" |SiOxNy
  +
|
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|
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|
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|[https://www.osapublishing.org/optica/abstract.cfm?uri=optica-4-5-532 A]
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|{{rl|ICP Etching Recipes|W-TiW Etch (Panasonic 1)}}
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! bgcolor="#d0e7ff" align="center" |'''Material'''
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
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| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
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| bgcolor="#daf1ff" |[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
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| bgcolor="#daf1ff" |[[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
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| width="95" bgcolor="#daf1ff" |[[Oxygen Plasma System Recipes#Plasma Clean .28YES EcoClean.29|Plasma Clean (YES EcoClean)]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
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| bgcolor="#daf1ff" |[[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
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| bgcolor="#daf1ff" |[[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
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  +
[[Category:Processing]]
= Recipes =
 
 
== RIE Etching ==
 
 
== ICP Etching ==
 

Revision as of 16:32, 4 February 2021

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A
Mo A
Ni R
Pt R
Ru A R A
Si R R R A
Ta A
Ti R A A
Al2O3 R A
Al2O3 (Sapphire) R A A
AlGaAs R R R A
AlGaN R A
AlN R A
CdZnTe R A
GaAs R R R R A
GaN R R R A
GaSb A R A
HfO2 A
InGaAlAs R R A
InGaAsP R R A
InP R A A R R
ITO R A
Photoresist

& ARC

A R R R A A A A
SiC R A A
SiN R R R A A
SiO2 R R R R R A
SiOxNy A A A
Ta2O5 A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)