Difference between revisions of "Dry Etching Recipes"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(minor edit)
(delete RIE1)
Line 2: Line 2:
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
 
{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
 
|- bgcolor="#d0e7ff"
 
|- bgcolor="#d0e7ff"
! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
+
! colspan="17" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 
|- bgcolor="#d0e7ff"
 
|- bgcolor="#d0e7ff"
 
|<!-- INTENTIONALLY LEFT BLANK -->
 
|<!-- INTENTIONALLY LEFT BLANK -->
! colspan="4" width="300" height="35" align="center" bgcolor="#d0e7ff" |'''[[RIE Etching Recipes|RIE Etching]]'''
+
! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
 
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
 
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
 
! colspan="5" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
 
! colspan="5" align="center" bgcolor="#d0e7ff" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
Line 11: Line 11:
 
|-
 
|-
 
! width="65" align="center" bgcolor="#d0e7ff" |'''Material'''
 
! width="65" align="center" bgcolor="#d0e7ff" |'''Material'''
| width="65" bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]]
 
 
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
 
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
 
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
 
| width="65" bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
Line 30: Line 29:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Ag
 
! align="center" bgcolor="#d0e7ff" |Ag
|
 
 
|
 
|
 
|
 
|
Line 49: Line 47:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Al
 
! align="center" bgcolor="#d0e7ff" |Al
|
 
 
|
 
|
 
|
 
|
Line 68: Line 65:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Au
 
! align="center" bgcolor="#d0e7ff" |Au
|
 
 
|
 
|
 
|
 
|
Line 87: Line 83:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Cr
 
! align="center" bgcolor="#d0e7ff" |Cr
|
 
 
|
 
|
 
|
 
|
Line 106: Line 101:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Cu
 
! align="center" bgcolor="#d0e7ff" |Cu
|
 
 
|
 
|
 
|
 
|
Line 125: Line 119:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Ge
 
! align="center" bgcolor="#d0e7ff" |Ge
|
 
 
|
 
|
 
|
 
|
Line 144: Line 137:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Mo
 
! align="center" bgcolor="#d0e7ff" |Mo
|
 
 
|
 
|
 
|
 
|
Line 163: Line 155:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Ni
 
! align="center" bgcolor="#d0e7ff" |Ni
|
 
 
|
 
|
 
|
 
|
Line 182: Line 173:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Pt
 
! align="center" bgcolor="#d0e7ff" |Pt
|
 
 
|
 
|
 
|
 
|
Line 201: Line 191:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Ru
 
! align="center" bgcolor="#d0e7ff" |Ru
|
 
 
|
 
|
 
|
 
|
Line 220: Line 209:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Si
 
! align="center" bgcolor="#d0e7ff" |Si
|
 
 
|
 
|
 
|
 
|
Line 239: Line 227:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Ta
 
! align="center" bgcolor="#d0e7ff" |Ta
|
 
 
|
 
|
 
|
 
|
Line 258: Line 245:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Ti
 
! align="center" bgcolor="#d0e7ff" |Ti
|
 
 
|
 
|
 
|
 
|
Line 277: Line 263:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3</sub>
 
! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3</sub>
|
 
 
|
 
|
 
|
 
|
Line 296: Line 281:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
 
! align="center" bgcolor="#d0e7ff" |Al<sub>2</sub>O<sub>3 (Sapphire)</sub>
|
 
 
|
 
|
 
|
 
|
Line 315: Line 299:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |AlGaAs
 
! align="center" bgcolor="#d0e7ff" |AlGaAs
|
 
 
|
 
|
 
|
 
|
Line 334: Line 317:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |AlGaN
 
! align="center" bgcolor="#d0e7ff" |AlGaN
|
 
 
|
 
|
 
|
 
|
Line 353: Line 335:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |AlN
 
! align="center" bgcolor="#d0e7ff" |AlN
|
 
 
|
 
|
 
|
 
|
Line 372: Line 353:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |CdZnTe
 
! align="center" bgcolor="#d0e7ff" |CdZnTe
|
 
 
|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
 
|
 
|
Line 391: Line 371:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |GaAs
 
! align="center" bgcolor="#d0e7ff" |GaAs
|
 
 
|
 
|
 
|
 
|
Line 410: Line 389:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |GaN
 
! align="center" bgcolor="#d0e7ff" |GaN
|
 
 
|
 
|
 
|
 
|
Line 429: Line 407:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |GaSb
 
! align="center" bgcolor="#d0e7ff" |GaSb
|
 
 
|
 
|
 
|
 
|
Line 448: Line 425:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |HfO<sub>2</sub>
 
! align="center" bgcolor="#d0e7ff" |HfO<sub>2</sub>
|
 
 
|
 
|
 
|
 
|
Line 467: Line 443:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |InGaAlAs
 
! align="center" bgcolor="#d0e7ff" |InGaAlAs
|
 
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|
 
|
Line 486: Line 461:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |InGaAsP
 
! align="center" bgcolor="#d0e7ff" |InGaAsP
|
 
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|
 
|
Line 505: Line 479:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |InP
 
! align="center" bgcolor="#d0e7ff" |InP
|
 
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
|
 
|
Line 524: Line 497:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |ITO
 
! align="center" bgcolor="#d0e7ff" |ITO
|
 
 
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 
|{{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 
|
 
|
Line 544: Line 516:
 
!Photoresist
 
!Photoresist
 
& ARC
 
& ARC
|
 
 
|
 
|
 
|A
 
|A
Line 563: Line 534:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |SiC
 
! align="center" bgcolor="#d0e7ff" |SiC
|
 
 
|
 
|
 
|
 
|
Line 582: Line 552:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |SiN
 
! align="center" bgcolor="#d0e7ff" |SiN
|
 
 
|
 
|
 
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
 
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiN<sub>x</sub> Etching (RIE 3)}}
Line 601: Line 570:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |SiO<sub>2</sub>
 
! align="center" bgcolor="#d0e7ff" |SiO<sub>2</sub>
|
 
 
|
 
|
 
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
 
|{{rl|RIE Etching Recipes|RIE 3 (MRC)|SiO<sub>2</sub> Etching (RIE 3)}}
Line 620: Line 588:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |SiOxNy
 
! align="center" bgcolor="#d0e7ff" |SiOxNy
|
 
 
|
 
|
 
|
 
|
Line 639: Line 606:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |Ta<sub>2</sub>O<sub>5</sub>
 
! align="center" bgcolor="#d0e7ff" |Ta<sub>2</sub>O<sub>5</sub>
|
 
 
|
 
|
 
|
 
|
Line 658: Line 624:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |TiN
 
! align="center" bgcolor="#d0e7ff" |TiN
|
 
 
|
 
|
 
|
 
|
Line 677: Line 642:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |TiO<sub>2</sub>
 
! align="center" bgcolor="#d0e7ff" |TiO<sub>2</sub>
|
 
 
|
 
|
 
|
 
|
Line 696: Line 660:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |W-TiW
 
! align="center" bgcolor="#d0e7ff" |W-TiW
|
 
 
|
 
|
 
|
 
|
Line 715: Line 678:
 
|- bgcolor="#eeffff"
 
|- bgcolor="#eeffff"
 
! align="center" bgcolor="#d0e7ff" |ZnO<sub>2</sub>
 
! align="center" bgcolor="#d0e7ff" |ZnO<sub>2</sub>
|
 
 
|
 
|
 
|
 
|
Line 734: Line 696:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |ZnS
 
! align="center" bgcolor="#d0e7ff" |ZnS
|
 
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|
 
|
Line 753: Line 714:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |ZnSe
 
! align="center" bgcolor="#d0e7ff" |ZnSe
|
 
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|{{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
|
 
|
Line 772: Line 732:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |ZrO<sub>2</sub>
 
! align="center" bgcolor="#d0e7ff" |ZrO<sub>2</sub>
|
 
 
|
 
|
 
|
 
|
Line 791: Line 750:
 
|-
 
|-
 
! align="center" bgcolor="#d0e7ff" |'''Material'''
 
! align="center" bgcolor="#d0e7ff" |'''Material'''
| bgcolor="#daf1ff" |[[RIE 1 (Custom)|RIE 1<br>(Retired)]]
 
 
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
 
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
 
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
 
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]

Revision as of 21:27, 16 September 2019

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A
Mo A
Ni R
Pt R
Ru A R A
Si R R R A
Ta A
Ti R A A
Al2O3 R A
Al2O3 (Sapphire) R A A
AlGaAs R R R A
AlGaN R A
AlN R A
CdZnTe R A
GaAs R R R R A
GaN R R R A
GaSb A R A
HfO2 A
InGaAlAs R R A
InGaAsP R R A
InP R A A R A
ITO R A
Photoresist

& ARC

A R R R A A A A
SiC R A A
SiN R R R A A
SiO2 R A R R R A
SiOxNy A A A
Ta2O5 A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)