Difference between revisions of "Dry Etching Recipes"

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m (deleted test links)
(renamed/linked SiDeepRIE → SLR Fluorine ICP)
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| width="100" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
 
| width="100" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
 
| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
 
| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
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| width="100" bgcolor="#daf1ff" | [[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|SLR Fluorine ICP (PlasmaTherm)]]
 
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
 
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
 
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
 
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
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| {{rl|ICP Etching Recipes|Si Etch (PlasmaTherm/Bosch Etch)}}
 
 
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| {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
 
| {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 1)}}
 
| {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}
 
| {{rl|ICP Etching Recipes|SiO2 Etching (Panasonic 2)}}

Revision as of 15:00, 28 August 2018

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
SLR Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag
Al A R R
Au R
Cr A R A
Cu
Ge A
Mo
Ni R
Pt R
Ru
Si R A R
Ta
Ti R A
Al2O3 R
Al2O3 (Sapphire) R A
AlGaAs R R R
AlGaN R
AlN R
CdZnTe R
GaAs R R R R
GaN R R R
GaSb A R
HfO2
InGaAlAs R R
InGaAsP R R
InP R A A R
ITO R
Photoresist

& ARC

A A A R A A
SiC R A
SiN R R R A
SiO2 R A R R R
SiOxNy A A
Ta2O5 A
TiN
TiO2
W-TiW R A
ZnO2
ZnS R
ZnSe R
ZrO2
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Si Deep RIE
(PlasmaTherm/Bosch Etch)
ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)