Difference between revisions of "Dry Etching Recipes"

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(ICP2 PR/ARC reipce link)
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{{Recipe Table Explanation}}
 
{{Recipe Table Explanation}}
{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%"
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{| class="wikitable" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center; font-size: 95%" border="1"
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! colspan="17" width="725" height="45" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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! width="725" height="45" colspan="17" | <div style="font-size: 150%;">Dry Etching Recipes</div>
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|- bgcolor="#d0e7ff"
 
| <!-- INTENTIONALLY LEFT BLANK -->
 
| <!-- INTENTIONALLY LEFT BLANK -->
! colspan="4" width="300" bgcolor="#D0E7FF" align="center" height="35" | '''[[RIE Etching Recipes|RIE Etching]]'''
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! width="300" height="35" align="center" bgcolor="#d0e7ff" colspan="4" | '''[[RIE Etching Recipes|RIE Etching]]'''
 
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
 
! colspan="5" |'''[[ICP Etching Recipes|ICP Etching]]'''
! colspan="4" bgcolor="#D0E7FF" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
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! align="center" bgcolor="#d0e7ff" colspan="4" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
! colspan="3" bgcolor="#D0E7FF" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
+
! align="center" bgcolor="#d0e7ff" colspan="3" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
|-
 
|-
! width="65" bgcolor="#D0E7FF" align="center" | '''Material'''
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! width="65" align="center" bgcolor="#d0e7ff" | '''Material'''
| width="65" bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
+
| width="65" bgcolor="#daf1ff" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
| width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+
| width="65" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| width="65" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+
| width="65" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| width="100" bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+
| width="100" bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+
| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
| width="100" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
+
| width="100" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PTI/Bosch)]]
| width="120" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
+
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic 1)]]
| width="120" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
+
| width="120" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic 2)]]
| width="85" bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+
| width="85" bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
| width="85" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+
| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
| width="95" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+
| width="95" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
| width="85" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+
| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
| width="85" bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+
| width="85" bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+
| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
+
| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
| width="85" bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
+
| width="85" bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
|- bgcolor="#EEFFFF"
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! bgcolor="#D0E7FF" align="center" | Ag
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
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|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
|{{rl|Other Dry Etching Recipes|Other Dry Etch (CAIBE (Oxford Ion Mill))}}
 
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! bgcolor="#D0E7FF" align="center" | Al<sub>2</sub>O<sub>3</sub>
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! bgcolor="#D0E7FF" align="center" | CdZnTe
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| {{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
 
| {{rl|RIE Etching Recipes|CdZnTe Etch (RIE 2)}}
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! bgcolor="#D0E7FF" align="center" | InGaAlAs
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| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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! bgcolor="#D0E7FF" align="center" | InP
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| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
 
| {{rl|RIE Etching Recipes|RIE 2 (MRC)|InP-InGaAsP-InGaAlAs Etching (RIE 2)|InP Etch (RIE 2)}}
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! bgcolor="#D0E7FF" align="center" | ITO
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| {{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
 
| {{rl|RIE Etching Recipes|ITO Etch (RIE 2)}}
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!Photoresist
 
!Photoresist
 
& ARC
 
& ARC
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|A
 
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|[https://www.nanotech.ucsb.edu/wiki/index.php/ICP_Etching_Recipes#Photoresist_and_ARC_etching R]
|A
 
 
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| {{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
 
| {{rl|Other Dry Etching Recipes|Other Dry Etch (Vapor HF Etcher)}}
 
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! bgcolor="#D0E7FF" align="center" | ZnS
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| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
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! bgcolor="#D0E7FF" align="center" | ZnSe
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| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
 
| {{rl|RIE Etching Recipes|ZnS Etching (RIE 2)}}
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! bgcolor="#D0E7FF" align="center" | ZrO<sub>2</sub>
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! bgcolor="#D0E7FF" align="center" | '''Material'''
+
! align="center" bgcolor="#d0e7ff" | '''Material'''
| bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
+
| bgcolor="#daf1ff" | [[RIE 1 (Custom)|RIE 1<br>(Retired)]]
| bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
+
| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> (MRC)]]
| bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
+
| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_3_.28MRC.29|RIE 3<br> (MRC)]]
| bgcolor="#DAF1FF" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" | [[RIE_Etching_Recipes#RIE_5_.28PlasmaTherm.29|RIE 5<br>(PlasmaTherm)]]
| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
+
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#DSEIII_.28PlasmaTherm.2FDeep_Silicon_Etcher.29|DSEIII<br>(PlasmaTherm)]]
| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]
+
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#Si_Deep_RIE_.28PlasmaTherm.2FBosch_Etch.29|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]]
| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
+
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_1_.28Panasonic_E626I.29|ICP Etch 1<br>(Panasonic E626I)]]
| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
+
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP_Etch_2_.28Panasonic_E640.29|ICP Etch 2<br>(Panasonic E640)]]
| bgcolor="#DAF1FF" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
+
| bgcolor="#daf1ff" | [[ICP_Etching_Recipes#ICP-Etch_.28Unaxis_VLR.29|ICP-Etch<br>(Unaxis VLR)]]
| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
+
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Ashers_.28Technics_PEII.29|Ashers<br>(Technics PEII)]]
| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
+
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Clean_.28Gasonics_2000.29|Plasma Clean<br>(Gasonics 2000)]]
| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
+
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#UV_Ozone_Reactor|UV Ozone Reactor]]
| bgcolor="#DAF1FF" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
+
| bgcolor="#daf1ff" | [[Oxygen_Plasma_System_Recipes#Plasma_Activation_.28EVG_810.29|Plasma Activation<br>(EVG 810)]]
| bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
+
| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#XeF2_Etch_.28Xetch.29|XeF2 Etch<br>(Xetch)]]
| bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
+
| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#Vapor_HF_Etch_.28uETCH.29|Vapor HF Etch<br>(uETCH)]]
| bgcolor="#DAF1FF" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
+
| bgcolor="#daf1ff" | [[Other_Dry_Etching_Recipes#CAIBE_.28Oxford_Ion_Mill.29|CAIBE<br>(Oxford)]]
 
|}
 
|}
   

Revision as of 13:44, 16 March 2018

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Si Deep RIE
(PTI/Bosch)
ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag
Al A R R
Au R
Cr A R A
Cu
Ge A
Mo
Ni R
Pt R
Ru
Si R R R
Ta
Ti R A
Al2O3
Al2O3 (Sapphire) R A
AlGaAs R R R
AlGaN R
AlN R
CdZnTe R
GaAs R R R R
GaN R R R
GaSb A R
HfO2
InGaAlAs R R
InGaAsP R R
InP R A A R
ITO R
Photoresist

& ARC

A A A R A A
SiC R A
SiN R R R A
SiO2 R R R R
SiOxNy
Ta2O5 A
TiN
TiO2
W-TiW R A
ZnO2
ZnS R
ZnSe R
ZrO2
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Si Deep RIE
(PlasmaTherm/Bosch Etch)
ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)