Difference between revisions of "Dry Etching Recipes"

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Revision as of 13:17, 8 January 2018

  • R = Recipe is available. Clicking this link will take you to the recipe.
  • A = Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Si Deep RIE
(PTI/Bosch)
ICP Etch 1
(Panasonic 1)
ICP Etch 2
(Panasonic 2)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag
Al A R R
Au R
Cr A R A
Cu
Ge A
Mo
Ni R
Pt R
Ru
Si A R R
Ta
Ti R A
Al2O3
Al2O3 (Sapphire) R A
AlGaAs R R R
AlGaN R
AlN R
CdZnTe R
GaAs R R R R
GaN [[RIE Etching Recipes#{{{2}}}|R]] R R
GaSb A R
HfO2
InGaAlAs R R
InGaAsP R R
InP R A A R
ITO R
Photoresist

& ARC

A A A A A A
SiC R A
SiN R R R A
SiO2 R R R R
SiOxNy
Ta2O5 A
TiN
TiO2
W-TiW R A
ZnO2
ZnS R
ZnSe R
ZrO2
Material RIE 1
(Retired)
RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Si Deep RIE
(PlasmaTherm/Bosch Etch)
ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean
(Gasonics 2000)
UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)