Difference between revisions of "Dry Etching Recipes"
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| width="65" bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]] |
| width="65" bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]] |
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| width="65" bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]] |
| width="65" bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]] |
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| − | | width=" |
+ | | width="100" bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]] |
| width="160" bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]] |
| width="160" bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]] |
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| width="120" bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]] |
| width="120" bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]] |
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| width="85" bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]] |
| width="85" bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]] |
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| width="85" bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]] |
| width="85" bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]] |
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| − | | width=" |
+ | | width="95" bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]] |
| width="85" bgcolor="#DAF1FF" | [[UV Ozone Reactor]] |
| width="85" bgcolor="#DAF1FF" | [[UV Ozone Reactor]] |
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| width="85" bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]] |
| width="85" bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]] |
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| + | ! bgcolor="#D0E7FF" align="center" | '''Material''' |
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| + | | bgcolor="#DAF1FF" | [[RIE 1 (Custom)|RIE 1<br>(Custom)]] |
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| + | | bgcolor="#DAF1FF" | [[RIE 2 (MRC)|RIE 2<br> (MRC)]] |
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| + | | bgcolor="#DAF1FF" | [[RIE 3 (MRC)|RIE 3<br> (MRC)]] |
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| + | | bgcolor="#DAF1FF" | [[RIE 5 (PlasmaTherm)|RIE 5<br>(PlasmaTherm)]] |
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| + | | bgcolor="#DAF1FF" | [[Si Deep RIE (PlasmaTherm/Bosch Etch)|Si Deep RIE<br>(PlasmaTherm/Bosch Etch)]] |
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| + | | bgcolor="#DAF1FF" | [[ICP Etch 1 (Panasonic E626I)|ICP Etch 1<br>(Panasonic E626I)]] |
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| + | | bgcolor="#DAF1FF" | [[ICP Etch 2 (Panasonic E640)|ICP Etch 2<br>(Panasonic E640)]] |
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| + | | bgcolor="#DAF1FF" | [[ICP-Etch (Unaxis VLR)|ICP-Etch<br>(Unaxis VLR)]] |
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| + | | bgcolor="#DAF1FF" | [[Ashers (Technics PEII)|Ashers<br>(Technics PEII)]] |
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| + | | bgcolor="#DAF1FF" | [[Plasma Clean (Gasonics 2000)|Plasma Clean<br>(Gasonics 2000)]] |
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| + | | bgcolor="#DAF1FF" | [[UV Ozone Reactor]] |
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| + | | bgcolor="#DAF1FF" | [[Plasma Activation (EVG 810)|Plasma Activation<br>(EVG 810)]] |
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| + | | bgcolor="#DAF1FF" | [[XeF2 Etch (Xetch)|XeF2 Etch<br>(Xetch)]] |
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Revision as of 19:23, 18 July 2012
Dry Etching Recipes
| ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RIE Etching | ICP Etching | Oxygen Plasma Systems | Other Dry Etchers | |||||||||||
| Material | RIE 1 (Custom) |
RIE 2 (MRC) |
RIE 3 (MRC) |
RIE 5 (PlasmaTherm) |
Si Deep RIE (PlasmaTherm/Bosch Etch) |
ICP Etch 1 (Panasonic E626I) |
ICP Etch 2 (Panasonic E640) |
ICP-Etch (Unaxis VLR) |
Ashers (Technics PEII) |
Plasma Clean (Gasonics 2000) |
UV Ozone Reactor | Plasma Activation (EVG 810) |
XeF2 Etch (Xetch) | |
| Al | ||||||||||||||
| Ti | ||||||||||||||
| Cr | ||||||||||||||
| Ge | ||||||||||||||
| Ag | ||||||||||||||
| Ru | ||||||||||||||
| Mo | ||||||||||||||
| Ta | ||||||||||||||
| W | ||||||||||||||
| Al2O3 | ||||||||||||||
| HfO2 | ||||||||||||||
| ITo | ||||||||||||||
| SiO2 | ||||||||||||||
| SiN | ||||||||||||||
| SiOxNy | ||||||||||||||
| Ta2O5 | ||||||||||||||
| TiO2 | ||||||||||||||
| TiN | ||||||||||||||
| ZnO2 | ||||||||||||||
| ZrO2 | ||||||||||||||
| GaAs | ||||||||||||||
| AlGaAs | ||||||||||||||
| InGaAlAs | ||||||||||||||
| InGaAsP | ||||||||||||||
| InP | ||||||||||||||
| GaN | ||||||||||||||
| AlGaN | ||||||||||||||
| AlN | ||||||||||||||
| GaN | ||||||||||||||
| AlGaN | ||||||||||||||
| AlN | ||||||||||||||
| GaSb | ||||||||||||||
| CdTe | ||||||||||||||
| ZnSe | ||||||||||||||
| Si | ||||||||||||||
| SiC | ||||||||||||||
| Sapphire | ||||||||||||||
| Material | RIE 1 (Custom) |
RIE 2 (MRC) |
RIE 3 (MRC) |
RIE 5 (PlasmaTherm) |
Si Deep RIE (PlasmaTherm/Bosch Etch) |
ICP Etch 1 (Panasonic E626I) |
ICP Etch 2 (Panasonic E640) |
ICP-Etch (Unaxis VLR) |
Ashers (Technics PEII) |
Plasma Clean (Gasonics 2000) |
UV Ozone Reactor | Plasma Activation (EVG 810) |
XeF2 Etch (Xetch) | |