Difference between revisions of "Dry Etching Recipes"

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! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 
! colspan="18" width="725" height="45" |<div style="font-size: 150%;">Dry Etching Recipes</div>
 
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! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
 
! colspan="3" |'''[[RIE Etching Recipes|RIE Etching]]'''
 
! colspan="6" |'''[[ICP Etching Recipes|ICP Etching]]'''
 
! colspan="6" |'''[[ICP Etching Recipes|ICP Etching]]'''
 
! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
 
! colspan="5" bgcolor="#d0e7ff" align="center" |'''[[Oxygen Plasma System Recipes|Oxygen Plasma Systems]]'''
 
! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
 
! colspan="3" bgcolor="#d0e7ff" align="center" |'''[[Other Dry Etching Recipes|Other Dry Etchers]]'''
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! bgcolor="#d0e7ff" align="center" |'''Material'''
 
! bgcolor="#d0e7ff" align="center" |'''Material'''
 
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]
 
| bgcolor="#daf1ff" |[[RIE_Etching_Recipes#RIE_2_.28MRC.29|RIE 2<br> <span style="font-size: 88%;">(MRC)</span>]]

Revision as of 15:54, 29 September 2022

Process Control Data

See linked page for process control data (dep rate/stress etc. over time), for a selection of often-used thin-film depositions.

Dry Etching Tools/Materials Table

  • R: Recipe is available. Clicking this link will take you to the recipe.
  • A: Material is available for use, but no recipes are provided.
Dry Etching Recipes
RIE Etching ICP Etching Oxygen Plasma Systems Other Dry Etchers
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)
Ag A
Al A R R A
Au R
Cr A R A A
Cu A
Ge A A A A
Mo A
Nb A A
Ni R
Os A A
Pt R
Ru A R A
Si R R A R A
Ta A A A
Ti R A A
Al2O3 A R A
Al2O3 (Sapphire) R A A
AlGaAs R R R R A
AlGaN R R A
AlN R A
BCB A
CdZnTe R A
GaAs R R R R R A
GaN R R A R R A
GaSb A A A R A
HfO2 A
InGaAlAs R A R A
InGaAsP R R R A
InP R A A R R R
ITO R A
LiNbO3 A
Photoresist

& ARC

A R R R R R R A
Ru A R
SiC R A A
SiN R A R R A A
SiO2 R R R R R A
SiOxNy A A A
SU8 A
Ta2O5 A A A
TiN A
TiO2 A
W-TiW R A A
ZnO2 A
ZnS R A
ZnSe R A
ZrO2 A
Material RIE 2
(MRC)
RIE 3
(MRC)
RIE 5
(PlasmaTherm)
DSEIII
(PlasmaTherm)
Fluorine ICP (PlasmaTherm) ICP Etch 1
(Panasonic E626I)
ICP Etch 2
(Panasonic E640)
Oxford ICP (PlasmaPro 100) ICP-Etch
(Unaxis VLR)
Ashers
(Technics PEII)
Plasma Clean (YES EcoClean) UV Ozone Reactor Plasma Activation
(EVG 810)
XeF2 Etch
(Xetch)
Vapor HF Etch
(uETCH)
CAIBE
(Oxford)