Direct-Write Lithography Recipes

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Maskless Aligner (Heidelberg MLA150)

Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.

Positive Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist	Spin Cond.	Bake	Thickness	Laser (nm)	Exposure Dose (mJ/cm2)	DeFocus	PEB	Developer	Developer Time	Comments
AZ4110	4 krpm/30s	95°C/60s	~ 1.1 µm	405	240	5	none	AZ400K:DI 1:4	50s	Used MLA design (good for isolated lines 0.8-1um)
AZ4330	4 krpm/30s	95°C/60s	~ 3.3 µm	405	320	6	none	AZ400K:DI 1:4	90s	Used MLA design
AZ4620
SPR 220-3.0	2.5 krpm/30s	115°C/90”	~ 2.7 µm	405	325	- 4	115°C/90s	AZ300MIF	60s	Used MLA design
SPR 955-CM0.9	3 krpm/30s	95°C/90”	~ 0.9 µm	405	250	- 7	110°C/90s	AZ300MIF	60s	Used MLA design
THMR-3600HP	1.5 krpm/45s250 rpm/s	100°C/60s	0.5 µm	405	180–220	-4	100°C/60s	AZ300MiF	20s	line/space: low dose for clear-field, high does for dark-field

Negative Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist	Spin Cond.	Bake	Thickness	Laser (nm)	Exposure Dose (mJ/cm2)	DeFocus	PEB	Flood	Developer	Developer Time	Comments
AZ5214	6 krpm/30s	95°C/60s	~ 1.0 µm	375	35	- 5	110°C/60s	60"	AZ300MIF	60s	Used UCSB design. Good for up to ~1.3um open line space.
AZnLOF2020	4 krpm/30s	110°C/60s	~ 2.1µm	375	340	- 3	110°C/60s	none	AZ300MIF	90s	Used UCSB design. Good for 2um open line space.
SU-8 2075			~70µm	375							Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end.

Greyscale Lithography (MLA150)

Description...

Resist	Spin Cond.	Bake	Thickness	Exposure Dose (mJ/cm2)	Focus Offset	PEB	Flood	Developer	Developer Time	Comments
AZ4620	– krpm/30”	95°C/60”					60"	AZ300MIF	60"	TBD