Difference between revisions of "Direct-Write Lithography Recipes"

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(Positive Resist (MLA150))
(Positive Resist (MLA150))
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|~ 3.3 µm
 
|~ 3.3 µm
 
|405
 
|405
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|320
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|6
 
|''none''
 
|''none''
 
|AZ400K:DI 1:4
 
|AZ400K:DI 1:4
 
|90s
 
|90s
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|Used MLA design
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|-
 
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|[[:File:Az p4620 photoresist data package.pdf|AZ4620]]
 
|[[:File:Az p4620 photoresist data package.pdf|AZ4620]]

Revision as of 14:12, 9 October 2020

UnderConstruction.jpg

Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Maskless Aligner (Heidelberg MLA150)

Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.

Positive Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist Spin Cond. Bake Thickness Laser (nm) Exposure Time| DeFocus PEB Developer Developer Time Comments
AZ4110 4 krpm/30s 95°C/60s ~ 1.1 µm 405 240 5 none AZ400K:DI 1:4 50s Used MLA design (good for isolated lines 0.8-1um)
AZ4330 4 krpm/30s 95°C/60s ~ 3.3 µm 405 320 6 none AZ400K:DI 1:4 90s Used MLA design
AZ4620
SPR 220-3.0 2.5 krpm/30s 115°C/90” ~ 2.7 µm 405 115°C/90s AZ300MIF 60s
SPR 955-CM0.9 3 krpm/30s 95°C/60” ~ 0.9 µm 405 110°C/60s AZ300MIF 60s
THMR-3600HP

Negative Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist Spin Cond. Bake Thickness Laser (nm) Exposure Time DeFocus PEB Flood Developer Developer Time Comments
AZ5214 6 krpm/30s 95°C/60s ~ 1.0 µm 405 60" AZ300MIF 60s
  • ???
AZnLOF2020 3 krpm/30s 110°C/90s ~ 2.1µm 405 none AZ300MIF 60s
SU-8 2075 ~70µm 375 Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end.

Greyscale Lithography (MLA150)

Description...

Resist Spin Cond. Bake Thickness Exposure Time Focus Offset PEB Flood Developer Developer Time Comments
AZ4620Z5214 ?? krpm/30” 95°C/60” ?? µm 60" AZ300MIF 60"
  • ???