Difference between revisions of "Direct-Write Lithography Recipes"

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General notes: Hotplates used, filters, laser wavelengths, etc.
  
General notes: Hotplates used, filters, laser wavelengths, etc.
   
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{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;"
  +
|- bgcolor="#D0E7FF"
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! width="100" |Resist
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! width="100" |Spin Cond.
  +
! width="75" |Bake
  +
! width="75" |Thickness
  +
! width="125" |Exposure Time
  +
! width="100" |Focus Offset
  +
! width="75" |PEB
  +
! width="100" |Developer
  +
! width="125" |Developer Time
  +
! width="300" |Comments
  +
|-
  +
|SPR955CM0.9
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|3 krpm/30”
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|95°C/60”
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|~ 0.9 um
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|
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|
  +
|
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|AZ300MIF
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|
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| align="left" |
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*??
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*{{fl|SPR955CMstepperrecipe.pdf|See SPR955CM data file}}
  +
|}
 
== Negative Resist (MLA150) ==
  
== Negative Resist (MLA150) ==
 
General notes: Hotplates used, filters, laser wavelengths, etc.
  
General notes: Hotplates used, filters, laser wavelengths, etc.
  +
  +
{| class="wikitable" border="1" style="border: 1px solid #D0E7FF; background-color:#ffffff; text-align:center;"
  +
|- bgcolor="#D0E7FF"
  +
! width="100" |Resist
  +
! width="100" |Spin Cond.
  +
! width="75" |Bake
  +
! width="75" |Thickness
  +
! width="125" |Exposure Time
  +
! width="100" |Focus Offset
  +
! width="75" |PEB
  +
! width="75" |Flood
  +
! width="100" |Developer
  +
! width="125" |Developer Time
  +
! width="300" |Comments
  +
|-
  +
|AZ5214
  +
|6 krpm/30”
  +
|95°C/60”
  +
|~ 1.0 um
  +
|
  +
|
  +
|
  +
|60"
  +
|AZ300MIF
  +
|60"
  +
| align="left" |
  +
*???
  +
|}

Revision as of 22:24, 13 September 2020

Back to Lithography Recipes.

UnderConstruction.jpg

Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Photolithography Recipes for the Heidelberg MLA150 will go here.

Positive Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist Spin Cond. Bake Thickness Exposure Time Focus Offset PEB Developer Developer Time Comments
SPR955CM0.9 3 krpm/30” 95°C/60” ~ 0.9 um AZ300MIF

Negative Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist Spin Cond. Bake Thickness Exposure Time Focus Offset PEB Flood Developer Developer Time Comments
AZ5214 6 krpm/30” 95°C/60” ~ 1.0 um 60" AZ300MIF 60"
  • ???
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