Difference between revisions of "Direct-Write Lithography Recipes"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(Added PR's we are characterizing)
Line 16: Line 16:
 
! width="75" |Bake
 
! width="75" |Bake
 
! width="75" |Thickness
 
! width="75" |Thickness
 +
!Laser (nm)
 
! width="125" |Exposure Time
 
! width="125" |Exposure Time
! width="100" |Focus Offset
+
! width="100" |DeFocus
 
! width="75" |PEB
 
! width="75" |PEB
 
! width="100" |Developer
 
! width="100" |Developer
Line 23: Line 24:
 
! width="300" |Comments
 
! width="300" |Comments
 
|-
 
|-
|SPR955CM0.9
+
|[[:File:AXP4000pb-Datasheet.pdf|AZ4110]]
|3 krpm/30”
+
|4 krpm/30s
|95°C/60”
+
|95°C/60s
|~ 0.9 um
+
|~ 1.1 µm
 +
|405
 +
|
 +
|
 +
|''none''
 +
|AZ400K:DI 1:4
 +
|50s
 +
|
 +
|-
 +
|[[:File:AXP4000pb-Datasheet.pdf|AZ4330]]
 +
|4 krpm/30s
 +
|95°C/60s
 +
|~ 3.3 µm
 +
|405
 +
|
 +
|
 +
|''none''
 +
|AZ400K:DI 1:4
 +
|90s
 +
|
 +
|-
 +
|[[:File:Az p4620 photoresist data package.pdf|AZ4620]]
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 
|
 
|
 +
|-
 +
|[[:File:SPR220-Positive-Resist-Datasheet.pdf|SPR 220-3.0]]
 +
|2.5 krpm/30s
 +
|115°C/90”
 +
|~ 2.7 µm
 +
|405
 
|
 
|
 
|
 
|
 +
|115°C/90s
 
|AZ300MIF
 
|AZ300MIF
 +
|60s
 
|
 
|
 +
|-
 +
|[[:File:SPR955-Positive-Resist-Datasheet.pdf|SPR 955-CM0.9]]
 +
|3 krpm/30s
 +
|95°C/60”
 +
|~ 0.9 µm
 +
|405
 +
|
 +
|
 +
|110°C/60s
 +
|AZ300MIF
 +
|60s
 
| align="left" |
 
| align="left" |
*??
+
|-
*{{fl|SPR955CMstepperrecipe.pdf|See SPR955CM data file}}
+
|[[:File:3600 D, D2v Spin Speed Curve.pdf|THMR-3600HP]]
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 
|}
 
|}
 
=== Negative Resist (MLA150) ===
 
=== Negative Resist (MLA150) ===
Line 45: Line 105:
 
! width="75" |Bake
 
! width="75" |Bake
 
! width="75" |Thickness
 
! width="75" |Thickness
 +
!Laser (nm)
 
! width="125" |Exposure Time
 
! width="125" |Exposure Time
! width="100" |Focus Offset
+
! width="100" |DeFocus
 
! width="75" |PEB
 
! width="75" |PEB
 
! width="75" |Flood
 
! width="75" |Flood
Line 53: Line 114:
 
! width="300" |Comments
 
! width="300" |Comments
 
|-
 
|-
|AZ5214
+
|[[:File:AZ5214-Negative-Resist-Datasheet.pdf|AZ5214]]
|6 krpm/30”
+
|6 krpm/30s
|95°C/60”
+
|95°C/60s
|~ 1.0 um
+
|~ 1.0 µm
 +
|405
 
|
 
|
 
|
 
|
Line 62: Line 124:
 
|60"
 
|60"
 
|AZ300MIF
 
|AZ300MIF
|60"
+
|60s
 
| align="left" |
 
| align="left" |
 
*???
 
*???
 +
|-
 +
|AZnLOF2020
 +
|3 krpm/30s
 +
|110°C/90s
 +
|~ 2.1µm
 +
|405
 +
|
 +
|
 +
|
 +
|''none''
 +
|AZ300MIF
 +
|60s
 +
|
 +
|-
 +
|[[:File:SU-8-2075-revA.pdf|SU-8 2075]]
 +
|
 +
|
 +
|~70µm
 +
|375
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|
 +
|Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end.
 
|}
 
|}
  
Line 83: Line 171:
 
! width="300" |Comments
 
! width="300" |Comments
 
|-
 
|-
|AZ5214
+
|AZ4620Z5214
|6 krpm/30”
+
|?? krpm/30”
 
|95°C/60”
 
|95°C/60”
|~ 1.0 um
+
|?? µm
 
|
 
|
 
|
 
|

Revision as of 16:27, 2 October 2020

UnderConstruction.jpg

Work In Progress

This article is still under construction. It may contain factual errors. Content is subject to change.


Maskless Aligner (Heidelberg MLA150)

Photolithography Recipes for the Heidelberg MLA150. Description of litho params- different lasers available, greyscale etc.

Positive Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist Spin Cond. Bake Thickness Laser (nm) Exposure Time DeFocus PEB Developer Developer Time Comments
AZ4110 4 krpm/30s 95°C/60s ~ 1.1 µm 405 none AZ400K:DI 1:4 50s
AZ4330 4 krpm/30s 95°C/60s ~ 3.3 µm 405 none AZ400K:DI 1:4 90s
AZ4620
SPR 220-3.0 2.5 krpm/30s 115°C/90” ~ 2.7 µm 405 115°C/90s AZ300MIF 60s
SPR 955-CM0.9 3 krpm/30s 95°C/60” ~ 0.9 µm 405 110°C/60s AZ300MIF 60s
THMR-3600HP

Negative Resist (MLA150)

General notes: Hotplates used, filters, laser wavelengths, etc.

Resist Spin Cond. Bake Thickness Laser (nm) Exposure Time DeFocus PEB Flood Developer Developer Time Comments
AZ5214 6 krpm/30s 95°C/60s ~ 1.0 µm 405 60" AZ300MIF 60s
  • ???
AZnLOF2020 3 krpm/30s 110°C/90s ~ 2.1µm 405 none AZ300MIF 60s
SU-8 2075 ~70µm 375 Extremely viscous. Pour into a wide-mouthed bottle, dispense directly from bottle. Replace napkin at end.

Greyscale Lithography

Description...

Resist Spin Cond. Bake Thickness Exposure Time Focus Offset PEB Flood Developer Developer Time Comments
AZ4620Z5214 ?? krpm/30” 95°C/60” ?? µm 60" AZ300MIF 60"
  • ???