Difference between revisions of "Dicing Saw (ADT)"

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(Corrected staff info infobox, added model number, added tape applicator model number, linked to recipes page)
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== About  ==
 
== About  ==
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers.  Check the [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
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The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers.  Check the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
  
 
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
 
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
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== Recipes ==
 
== Recipes ==
* Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)]
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* Packaging Recipes > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)]
 
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.
 
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.

Revision as of 17:31, 6 April 2020

Dicing Saw (ADT)
ADT.jpg
Tool Type Packaging
Location Dicing Room: ESB 1147
Supervisor Aidan Hopkins
Supervisor Phone (805) 893-2343
Supervisor E-Mail hopkins@ece.ucsb.edu
Description ADT Dicing Saw
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Sign up for this tool


About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

Detailed Specifications

Operating Procedures


Recipes

Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.