Difference between revisions of "Dicing Saw (ADT)"
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|picture=ADT.jpg |
|picture=ADT.jpg |
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|type = Packaging |
|type = Packaging |
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|super= Lee Sawyer |
|super= Lee Sawyer |
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| + | |super2= Aidan Hopkins |
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| − | |location= |
+ | |location=Backend Lab: ESB 1111 |
|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
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|model = ADT 7100 |
|model = ADT 7100 |
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| − | == |
+ | ==About== |
| + | The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size. |
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| − | * [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] - Disregard and refer to SOP above |
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| − | * [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]] |
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| − | * [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]] |
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| + | *Maximum Wafer Size: 8" |
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| + | *Parts mounted to UV-release tape for dicing |
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| + | *Automated cut maps at multiple angles (0° and 90° typical) |
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| + | *~Few micron alignment to on-wafer features. |
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| + | *Thermocarbon Resnoid dicing blades provided by Staff |
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| + | *[https://wiki.nanotech.ucsb.edu/w/images/0/01/Tape_Station_SOP_Rev_A.pdf Tape Station Standard Operating Procedure] |
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| + | *[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS] |
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| + | *Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]''' |
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| − | * Recipes > Packaging > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 '''Dicing Saw Recipes (ADT 7100)'''] |
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Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
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Latest revision as of 15:11, 17 October 2023
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About
The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.
Contact Staff for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for dicing
- Automated cut maps at multiple angles (0° and 90° typical)
- ~Few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by Staff
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Tape Station Standard Operating Procedure
- Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS
- Recovering an Old Recipe
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.