Difference between revisions of "Dicing Saw (ADT)"

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{{tool|{{PAGENAME}}
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{{tool2|{{PAGENAME}}
 
|picture=ADT.jpg
  
|picture=ADT.jpg
 
|type = Packaging
  
|type = Packaging
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|super= Aidan Hopkins
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|super= Lee Sawyer
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|super2= Aidan Hopkins
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|phone= 805-893-3918x208
  
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|location=Dicing Saw Room
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|location=Backend Lab: ESB 1111
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|email=hopkins@ece.ucsb.edu
  
 
|description = ADT Dicing Saw
  
|description = ADT Dicing Saw
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|model = ADT 7100
 
|manufacturer = Advanced Dicing Technologies Ltd.
  
|manufacturer = Advanced Dicing Technologies Ltd.
 
|materials =
 
|materials =
 
|toolid=49
  
|toolid=49
 
}}
 
}}
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== About ==
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==About==
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The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.
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The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
  
   
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Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
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== Detailed Specifications ==
  
   
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An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.
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== Operating Procedures ==
  
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* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]]
  
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* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]]
  
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* [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]]
  
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* [[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
  
   
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Contact Staff for blades and dicing frames for your group.
   
  ⚫
==Detailed Specifications==
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== Recipes ==
  
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* Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)]
  
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*Maximum Wafer Size: 8"
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Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.
  
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*Parts mounted to UV-release tape for dicing
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*Automated cut maps at multiple angles (0° and 90° typical)
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*~Few micron alignment to on-wafer features.
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*Thermocarbon Resnoid dicing blades provided by Staff
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  ⚫
==Operating Procedures==
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*[https://wiki.nanofab.ucsb.edu/w/images/5/54/ADT_SOP_Rev_J.pdf ADT Dicing Saw Standard Operating Procedure]
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*[https://wiki.nanotech.ucsb.edu/w/images/0/01/Tape_Station_SOP_Rev_A.pdf Tape Station Standard Operating Procedure]
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*[https://wiki.nanofab.ucsb.edu/w/images/5/5a/Ultron_1042R_Film_specs.pdf Ultron Systems, Inc. 1042R Anti-Static Ultraviolet Film TDS]
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*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
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  ⚫
==Recipes==
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*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]'''
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  ⚫
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Latest revision as of 15:11, 17 October 2023

Dicing Saw (ADT)
ADT.jpg
Location Backend Lab: ESB 1111
Tool Type Packaging
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Description ADT Dicing Saw
Primary Supervisor Lee Sawyer
(805) 893-2123
lee_sawyer@ucsb.edu

Secondary Supervisor

Aidan Hopkins

Recipes N/A
SignupMonkey: Sign up for this tool


About

The Model 7100 Series is a semi-automatic dicing saw. Semiconductor, glass, and plastic substrates of all types can be automatically or manually cut. This dicing Saw is optimized for multi-angle dicing of tight tolerance substrates up to 200 mm diameter in size.

Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator is used to mount samples to UV-release tape for dicing and an Ultron Systems UH104-8 UV lamp system is used to release samples post dicing.

Contact Staff for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for dicing
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~Few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by Staff

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

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