Difference between revisions of "Dicing Saw (ADT)"
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| − | == |
+ | ==About== |
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. |
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. |
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Contact the tool supervisor for blades and dicing frames for your group. |
Contact the tool supervisor for blades and dicing frames for your group. |
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+ | ==Detailed Specifications== |
| + | *Maximum Wafer Size: 8" |
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| + | *Parts mounted to UV-release tape for cutting |
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| + | *Automated cut maps at multiple angles (0° and 90° typical) |
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| − | * [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] - Disregard and refer to SOP above |
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| + | *~few micron alignment to on-wafer features. |
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| − | * [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]] |
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| + | *Thermocarbon Resnoid dicing blades provided by staff |
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| − | * [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]] |
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| + | *[https://wiki.nanotech.ucsb.edu/w/images/0/01/Tape_Station_SOP_Rev_A.pdf Tape Station Standard Operating Procedure] |
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| + | *Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]''' |
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| − | * Recipes > Packaging > [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 '''Dicing Saw Recipes (ADT 7100)'''] |
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Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
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Revision as of 11:02, 26 April 2022
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for cutting
- Automated cut maps at multiple angles (0° and 90° typical)
- ~few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by staff
Operating Procedures
- ADT Dicing Saw Standard Operating Procedure
- Tape Station Standard Operating Procedure
- Recovering an Old Recipe
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.