Difference between revisions of "Dicing Saw (ADT)"
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(→Detailed Specifications: deleted old SOP, Lee's SOP only) |
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|picture=ADT.jpg |
|picture=ADT.jpg |
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|type = Packaging |
|type = Packaging |
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| − | |super= |
+ | |super= Lee Sawyer |
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| − | |phone= 805-893-3918x208 |
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| ⚫ | |||
| − | |email=hopkins@ece.ucsb.edu |
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|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
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| + | |model = ADT 7100 |
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|manufacturer = Advanced Dicing Technologies Ltd. |
|manufacturer = Advanced Dicing Technologies Ltd. |
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|materials = |
|materials = |
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| + | |toolid=49 |
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}} |
}} |
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| − | = |
+ | ==About== |
| + | The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. |
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| + | An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing. |
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| − | =Dicing Seminar= |
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| + | |||
| − | *[[Media:ADT-Applications.pdf|Applications]] |
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| + | Contact the tool supervisor for blades and dicing frames for your group. |
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| − | *[[Media:ADT-Blade-Part1.pdf|Dicing Blade Technical Seminar - Part 1]] |
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| + | |||
| − | *[[Media:ADT-Blade-Part2.pdf|Dicing Blade Technical Seminar - Part 2]] |
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| + | ==Detailed Specifications== |
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| − | *[[Media:ADT-Blade-Part3.pdf|Dicing Blade Technical Seminar - Part 3]] |
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| + | |||
| − | *[[Media:ADT-Dressing.pdf|Dressing]] |
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| + | * Maximum Wafer Size: 8" |
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| − | *[[Media:ADT-Dressing-Requirements.pdf|Dressing requirements & Instructions per Application]] |
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| + | * Parts mounted to UV-release tape for cutting |
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| − | *[[Media:ADT-MagneticHeadDicingProcess.pdf|Magnetic Head Dicing Process]] |
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| + | * Automated cut maps at multiple angles (0° and 90° typical) |
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| − | *[[Media:ADT-QNF-Singulation.pdf|QNF Singulation]] |
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| + | * ~few micron alignment to on-wafer features. |
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| − | *[[Media:ADT-Troubleshooting.pdf|Troubleshooting]] |
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| + | * Thermocarbon Resnoid dicing blades provided by staff |
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| + | |||
| + | ==Operating Procedures== |
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| + | |||
| + | *[https://wiki.nanotech.ucsb.edu/w/images/5/57/ADT_SOP_Rev_D.pdf ADT Dicing Saw Standard Operating Procedure] |
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| + | *[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]] |
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| + | |||
| + | |||
| + | ==Recipes== |
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| + | |||
| + | *Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]''' |
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| + | |||
| + | Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting. |
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Revision as of 10:26, 23 September 2021
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
- Maximum Wafer Size: 8"
- Parts mounted to UV-release tape for cutting
- Automated cut maps at multiple angles (0° and 90° typical)
- ~few micron alignment to on-wafer features.
- Thermocarbon Resnoid dicing blades provided by staff
Operating Procedures
Recipes
- Recipes > Packaging > Dicing Saw Recipes (ADT 7100)
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.