Difference between revisions of "Dicing Saw (ADT)"

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(→‎Detailed Specifications: deleted old SOP, Lee's SOP only)
 
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|picture=ADT.jpg
 
|picture=ADT.jpg
 
|type = Packaging
 
|type = Packaging
|super= Aidan Hopkins
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|super= Lee Sawyer
|phone= 805-893-3918x208
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|location=Dicing Room: ESB 1147
|location=Dicing Saw Room
 
|email=hopkins@ece.ucsb.edu
 
 
|description = ADT Dicing Saw
 
|description = ADT Dicing Saw
 +
|model = ADT 7100
 
|manufacturer = Advanced Dicing Technologies Ltd.
 
|manufacturer = Advanced Dicing Technologies Ltd.
 
|materials =  
 
|materials =  
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|toolid=49
 
}}  
 
}}  
= About  =
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==About==
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The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
  
=Dicing Seminar=
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An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
*[[Media:ADT-Applications.pdf|Applications]]
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*[[Media:ADT-Blade-Part1.pdf|Dicing Blade Technical Seminar - Part 1]]
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Contact the tool supervisor for blades and dicing frames for your group.
*[[Media:ADT-Blade-Part2.pdf|Dicing Blade Technical Seminar - Part 2]]
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*[[Media:ADT-Blade-Part3.pdf|Dicing Blade Technical Seminar - Part 3]]
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==Detailed Specifications==
*[[Media:ADT-Dressing.pdf|Dressing]]
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*[[Media:ADT-Dressing-Requirements.pdf|Dressing requirements & Instructions per Application]]
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* Maximum Wafer Size: 8"
*[[Media:ADT-MagneticHeadDicingProcess.pdf|Magnetic Head Dicing Process]]
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* Parts mounted to UV-release tape for cutting
*[[Media:ADT-QNF-Singulation.pdf|QNF Singulation]]
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* Automated cut maps at multiple angles (0° and 90° typical)
*[[Media:ADT-Troubleshooting.pdf|Troubleshooting]]
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* ~few micron alignment to on-wafer features.
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* Thermocarbon Resnoid dicing blades provided by staff
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==Operating Procedures==
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*[https://wiki.nanotech.ucsb.edu/w/images/5/57/ADT_SOP_Rev_D.pdf ADT Dicing Saw Standard Operating Procedure]
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*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
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==Recipes==
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*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]'''
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Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Latest revision as of 09:26, 23 September 2021

Dicing Saw (ADT)
ADT.jpg
Tool Type Packaging
Location Dicing Room: ESB 1147
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail lee_sawyer@ucsb.edu
Description ADT Dicing Saw
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Sign up for this tool


About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for cutting
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by staff

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.