Difference between revisions of "Dicing Saw (ADT)"

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(→‎Recipes: corrected link to recipes)
(→‎Detailed Specifications: deleted old SOP, Lee's SOP only)
 
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==Detailed Specifications==
 
==Detailed Specifications==
 +
 +
* Maximum Wafer Size: 8"
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* Parts mounted to UV-release tape for cutting
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* Automated cut maps at multiple angles (0° and 90° typical)
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* ~few micron alignment to on-wafer features.
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* Thermocarbon Resnoid dicing blades provided by staff
  
 
==Operating Procedures==
 
==Operating Procedures==
  
 
*[https://wiki.nanotech.ucsb.edu/w/images/5/57/ADT_SOP_Rev_D.pdf ADT Dicing Saw Standard Operating Procedure]
 
*[https://wiki.nanotech.ucsb.edu/w/images/5/57/ADT_SOP_Rev_D.pdf ADT Dicing Saw Standard Operating Procedure]
*[[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] - Disregard and refer to SOP above
 
*[[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]]
 
*[[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]]
 
 
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
 
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
  

Latest revision as of 09:26, 23 September 2021

Dicing Saw (ADT)
ADT.jpg
Tool Type Packaging
Location Dicing Room: ESB 1147
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail lee_sawyer@ucsb.edu
Description ADT Dicing Saw
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Sign up for this tool


About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for cutting
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by staff

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.