Difference between revisions of "Dicing Saw (ADT)"

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(Corrected staff info infobox, added model number, added tape applicator model number, linked to recipes page)
(→‎Detailed Specifications: deleted old SOP, Lee's SOP only)
 
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|picture=ADT.jpg
 
|picture=ADT.jpg
 
|type = Packaging
 
|type = Packaging
|super= Aidan Hopkins
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|super= Lee Sawyer
 
|location=Dicing Room: ESB 1147
 
|location=Dicing Room: ESB 1147
 
|description = ADT Dicing Saw
 
|description = ADT Dicing Saw
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== About ==
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==About==
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers.  Check the [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
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The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers.  Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
  
 
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
 
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
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Contact the tool supervisor for blades and dicing frames for your group.
 
Contact the tool supervisor for blades and dicing frames for your group.
  
== Detailed Specifications ==
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==Detailed Specifications==
  
== Operating Procedures ==
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* Maximum Wafer Size: 8"
* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]]
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* Parts mounted to UV-release tape for cutting
* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]]
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* Automated cut maps at multiple angles (0° and 90° typical)
* [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]]
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* ~few micron alignment to on-wafer features.
* [[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
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* Thermocarbon Resnoid dicing blades provided by staff
  
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==Operating Procedures==
  
== Recipes ==
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*[https://wiki.nanotech.ucsb.edu/w/images/5/57/ADT_SOP_Rev_D.pdf ADT Dicing Saw Standard Operating Procedure]
* Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)]
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*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.
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==Recipes==
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*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]'''
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Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.

Latest revision as of 09:26, 23 September 2021

Dicing Saw (ADT)
ADT.jpg
Tool Type Packaging
Location Dicing Room: ESB 1147
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail lee_sawyer@ucsb.edu
Description ADT Dicing Saw
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Sign up for this tool


About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for cutting
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by staff

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.