Difference between revisions of "Dicing Saw (ADT)"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(→‎Detailed Specifications: deleted old SOP, Lee's SOP only)
 
(21 intermediate revisions by 5 users not shown)
Line 2: Line 2:
 
|picture=ADT.jpg
 
|picture=ADT.jpg
 
|type = Packaging
 
|type = Packaging
|super= Aidan Hopkins
+
|super= Lee Sawyer
|phone= 805-893-3918x208
+
|location=Dicing Room: ESB 1147
|location=Dicing Saw Room
 
|email=hopkins@ece.ucsb.edu
 
 
|description = ADT Dicing Saw
 
|description = ADT Dicing Saw
 +
|model = ADT 7100
 
|manufacturer = Advanced Dicing Technologies Ltd.
 
|manufacturer = Advanced Dicing Technologies Ltd.
 
|materials =  
 
|materials =  
 
|toolid=49
 
|toolid=49
 
}}  
 
}}  
== About ==
+
==About==
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers.  Check the Dicing Saw Recipes page for the blades we currently stock.
+
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 8” diameter wafers.  Check the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock.
  
== Detailed Specifications ==
+
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
  
== Operating Procedures ==
+
Contact the tool supervisor for blades and dicing frames for your group.
Right click on the blade icon in the lower left corner of the screen and select 'Blade Change'.
 
  
Open the dicing saw cover and place the interlock defeating key in the door interlock.
+
==Detailed Specifications==
  
Grab your blade/flange (with the grabbing tool or hand) and CAREFULLY place it onto the spindle.  This should require very little force.  If the flange doesn't easily slide onto the spindle please contact me immediately.
+
* Maximum Wafer Size: 8"
 +
* Parts mounted to UV-release tape for cutting
 +
* Automated cut maps at multiple angles (0° and 90° typical)
 +
* ~few micron alignment to on-wafer features.
 +
* Thermocarbon Resnoid dicing blades provided by staff
  
Once you have installed your blade and flange onto the spindle you must secure it with the lock nut.  To do this, line up any of the two holes on the lock nut with the two pins on the two piece torque wrench tool.  Hold the back part of the wrench in place with one hand and turn the front part of the wrench clockwise with the other hand.  Once the lock nut is hand tight you'll have to crank on the torque wrench until you hear a click.  That should be the appropriate amount of torque to keep the flange on the spindle.
+
==Operating Procedures==
  
From the 'Blade Selection' drop down menu, choose blade you just installed. If you are using a different flange diameter from the one selected in the software click the 'Change Flange' box and manually enter in the new flange diameter. Click 'Done' and then click 'Finish' in the lower left dialogue box.
+
*[https://wiki.nanotech.ucsb.edu/w/images/5/57/ADT_SOP_Rev_D.pdf ADT Dicing Saw Standard Operating Procedure]
 +
*[[ADT 7100 - Recovering an Old Recipe (2019)|Recovering an Old Recipe]]
  
DO NOT STICK YOUR HANDS INTO THE SYSTEM!  The saw will eventually start to rotate and go through its blade exposure measurement sequence.
 
  
Once it says 'Blade change completed' inside the dialogue box you can check the three water sources.
+
==Recipes==
  
BE EXTREMELY CAREFUL!  The spindle is still rotating!  Carefully pull the spindle cover lock to the left and open the spindle cover.
+
*Recipes > Packaging > '''[[Packaging Recipes#Dicing Saw Recipes .28ADT 7100.29|Dicing Saw Recipes (ADT 7100)]]'''
  
Press the 'Water Adjust' to turn on the three different water sources.  Verify that the Cut water is
+
Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.
 
 
== Recipes ==
 
* Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)]
 
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.
 

Latest revision as of 09:26, 23 September 2021

Dicing Saw (ADT)
ADT.jpg
Tool Type Packaging
Location Dicing Room: ESB 1147
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail lee_sawyer@ucsb.edu
Description ADT Dicing Saw
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Sign up for this tool


About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

Detailed Specifications

  • Maximum Wafer Size: 8"
  • Parts mounted to UV-release tape for cutting
  • Automated cut maps at multiple angles (0° and 90° typical)
  • ~few micron alignment to on-wafer features.
  • Thermocarbon Resnoid dicing blades provided by staff

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.