Difference between revisions of "Dicing Saw (ADT)"

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(Contact info)
(→‎Operating Procedures: Add link to updated SOP)
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== Operating Procedures ==
 
== Operating Procedures ==
* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]]
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* [https://wiki.nanotech.ucsb.edu/w/images/e/ef/ADT_Dicing_Saw_SOP_Rev_B.pdf Dicing Saw Standard Operating Procedure]
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* [[ADT 7100 - Initial Setup Before Cutting|Setting up the Saw before Cutting]] - Disregard and refer to SOP above
 
* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]]
 
* [[ADT 7100 - Standard Dicing Procedure - Programmed Cut Map|Standard Dicing Procedure - Programmed Cut Map]]
 
* [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]]
 
* [[ADT 7100 - Standard Dicing Procedure - Single Cuts|Standard Dicing Procedure - Single Cuts]]

Revision as of 13:19, 10 August 2021

Dicing Saw (ADT)
ADT.jpg
Tool Type Packaging
Location Dicing Room: ESB 1147
Supervisor Lee Sawyer
Supervisor Phone (805) 893-2123
Supervisor E-Mail lee_sawyer@ucsb.edu
Description ADT Dicing Saw
Manufacturer Advanced Dicing Technologies Ltd.
Model ADT 7100
Sign up for this tool


About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.

An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.

Contact the tool supervisor for blades and dicing frames for your group.

Detailed Specifications

Operating Procedures


Recipes

Be sure to also see the recipes for protecting your sample from dicing dust, and mounting/unmounting.