Difference between revisions of "Dicing Saw (ADT)"
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(Corrected staff info infobox, added model number, added tape applicator model number, linked to recipes page) |
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|picture=ADT.jpg |
|picture=ADT.jpg |
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|type = Packaging |
|type = Packaging |
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+ | |super= Lee Sawyer |
|location=Dicing Room: ESB 1147 |
|location=Dicing Room: ESB 1147 |
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|description = ADT Dicing Saw |
|description = ADT Dicing Saw |
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== About == |
== About == |
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| − | The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https:// |
+ | The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes page] for the blades we currently stock. |
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing. |
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing. |
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== Recipes == |
== Recipes == |
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| − | * Packaging Recipes > [https:// |
+ | * Packaging Recipes > [https://wiki.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)] |
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting. |
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting. |
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Revision as of 10:55, 15 April 2020
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About
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 8” diameter wafers. Check the Dicing Saw Recipes page for the blades we currently stock.
An ADT WM-966 tape applicator & Ultron Systems UH104-8 UV lamp system is used to apply UV-release tape for securing die during dicing.
Contact the tool supervisor for blades and dicing frames for your group.
Detailed Specifications
Operating Procedures
- Setting up the Saw before Cutting
- Standard Dicing Procedure - Programmed Cut Map
- Standard Dicing Procedure - Single Cuts
- Recovering an Old Recipe
Recipes
- Packaging Recipes > Dicing Saw Recipes (ADT 7100)
Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.