Difference between revisions of "Dicing Saw (ADT)"

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= About  =
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== About  ==
 
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 6” diameter wafers.
 
The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.  It is currently setup for dicing up to 6” diameter wafers.
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== Recipes ==
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* Packaging Recipes > [https://www.nanotech.ucsb.edu/wiki/index.php/Packaging_Recipes?venotify=created#Dicing_Saw_Recipes_.28ADT_7100.29 Dicing Saw Recipes (ADT 7100)]
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Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.

Revision as of 07:58, 16 October 2018

Dicing Saw (ADT)
ADT.jpg
Tool Type Packaging
Location Dicing Saw Room
Supervisor Aidan Hopkins
Supervisor Phone (805) 893-2343
Supervisor E-Mail hopkins@ece.ucsb.edu
Description ADT Dicing Saw
Manufacturer Advanced Dicing Technologies Ltd.
Sign up for this tool


About

The ADT 7100 Dicing Saw is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm. It is currently setup for dicing up to 6” diameter wafers.

Recipes

Be sure to also see the methods for protecting your sample from dicing dust, and mounting/unmounting.