Difference between revisions of "Chemical-Mechanical Polisher (Logitech)"

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(link to Logitech Bonder)
(CMP SOP)
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Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.
 
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.
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=Instructions=
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CMP SOP

Revision as of 13:12, 23 August 2022

Chemical-Mechanical Polisher (Logitech)
CMP.jpg
Tool Type Dry Etch
Location Bay 5
Supervisor Bill Millerski
Supervisor Phone (805) 893-2655
Supervisor E-Mail wmillerski@ucsb.edu
Description ORBIS Chemical Mechanical Polisher
Manufacturer Logitech
Dry Etch Recipes
Sign up for this tool


About

The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system.

Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the Logitech Bonder.

Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.

Instructions

CMP SOP