Difference between revisions of "Chemical-Mechanical Polisher (Logitech)"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
Line 2: Line 2:
|type = Dry Etch
|type = Dry Etch
|super= Don Freeborn
|super= Brian Lingg
|location=Bay 5
|location=Bay 5

Revision as of 10:45, 15 April 2020

Chemical-Mechanical Polisher (Logitech)
Tool Type Dry Etch
Location Bay 5
Supervisor Brian Lingg
Supervisor Phone (805) 893-8145
Supervisor E-Mail lingg_b@ucsb.edu
Description ORBIS Chemical Mechanical Polisher
Manufacturer Logitech
Dry Etch Recipes
Sign up for this tool


The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system. Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. Logitech directly assists our users through expert consultation.