Difference between revisions of "Chemical-Mechanical Polisher (Logitech)"
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| − | The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. |
+ | The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system. |
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| + | Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the [[Wafer Bonder (Logitech WBS7)|Logitech Bonder]]. |
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| + | Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications. |
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Revision as of 17:06, 3 March 2022
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About
The Logitech Orbis system is used in the facility for fine-scale polishing and planarization of a variety of materials including glass, silicon, GaAs, InP, GaN, etc. Wafers up to 6” diameter can be polished on the system.
Several slurries and pads are available to provide a range of polishing options depending on the material being processed. Pieces can also be handled on the system by wax-mounting with the Logitech Bonder.
Each process is often unique in geometry and material combinations so that independent process development is required for most CMP applications.