Difference between revisions of "Bill Millerski"
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=Tools= |
=Tools= |
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{{PAGENAME}} is the supervisor for the following tools. |
{{PAGENAME}} is the supervisor for the following tools. |
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| − | |- valign="top" |
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| − | =About= |
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| − | =Current Work= |
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| − | =Tools= |
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| − | Bill Millerski is in charge of the following tools: |
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| − | {{tool|{{PAGENAME}} |
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| − | |picture=FlexAL.jpg |
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| − | {{tool|{{PAGENAME}} |
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| − | |type = Vacuum Deposition |
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| − | |super= Bill Millerski |
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| − | |phone=(805)839-2655 |
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| − | |location=Bay 2 |
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| − | |email=wmillerski@ucsb.edu |
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| − | |||
| − | |toolid=6 |
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| − | }} |
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{| |
{| |
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* [[Stepper 2 (AutoStep 200)]] |
* [[Stepper 2 (AutoStep 200)]] |
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* [[Ion Beam Deposition (Veeco NEXUS)]] |
* [[Ion Beam Deposition (Veeco NEXUS)]] |
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| + | * [[RIE 5 (PlasmaTherm)]] |
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| + | * [[Rapid Thermal Processor (AET RX6)]] |
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| + | * [[Rapid Thermal Processor (SSI Solaris 150)]] |
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| + | * [[Step Profilometer (KLA Tencor P-7)]] |
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| + | * [[Chemical-Mechanical Polisher (Logitech)]] |
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| + | * [[XeF2 Etch (Xetch)]] |
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| + | * [[Mechanical Polisher (Allied)]] |
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| + | * [[Tube Furnace Wafer Bonding (Thermco)]] |
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| + | * [[E-Beam 1 (Sharon)]] |
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| + | * [[Resistivity Mapper (CDE RESMAP)]] |
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| + | * [[Optical Film Thickness (Nanometric)]] |
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| + | * [[Vapor HF Etch]] |
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| + | * [[Wafer Bonder (Logitech WBS7)]] |
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Latest revision as of 08:28, 28 October 2021
|
About
.
.
.
Tools
Bill Millerski is the supervisor for the following tools.