Difference between revisions of "Bill Millerski"
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{{staff|{{PAGENAME}} |
{{staff|{{PAGENAME}} |
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− | |position = Equipment Engineer |
+ | |position = Senior Equipment Engineer |
|room = 1109F |
|room = 1109F |
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− | |phone = (805) |
+ | |phone = (805) 839-2655 |
− | |cell = |
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|email = wmillerski@ucsb.edu |
|email = wmillerski@ucsb.edu |
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}} |
}} |
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− | =About= |
+ | = About = |
+ | . |
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+ | . |
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− | =Current Work= |
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+ | |||
+ | . |
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=Tools= |
=Tools= |
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− | + | {{PAGENAME}} is the supervisor for the following tools. |
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− | {{tool|{{PAGENAME}} |
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− | |picture=FlexAL.jpg |
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− | {{tool|{{PAGENAME}} |
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− | |type = Vacuum Deposition |
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− | |super= Bill Millerski |
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− | |phone=(805)839-2655 |
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− | |location=Bay 2 |
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− | |email=wmillerski@ucsb.edu |
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− | |description = Oxford FlexAL Atomic Layer Deposition |
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− | |manufacturer = [http://www.oxford-instruments.com/businesses/plasma-technology/Pages/plasma-technology.aspx Oxford Instruments Plasma Technologies] |
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− | |materials = |
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− | |toolid=6 |
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− | }} |
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{| |
{| |
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* [[Stepper 2 (AutoStep 200)]] |
* [[Stepper 2 (AutoStep 200)]] |
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* [[Ion Beam Deposition (Veeco NEXUS)]] |
* [[Ion Beam Deposition (Veeco NEXUS)]] |
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+ | * [[RIE 5 (PlasmaTherm)]] |
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+ | * [[Rapid Thermal Processor (AET RX6)]] |
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+ | * [[Rapid Thermal Processor (SSI Solaris 150)]] |
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+ | * [[Step Profilometer (KLA Tencor P-7)]] |
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+ | * [[Chemical-Mechanical Polisher (Logitech)]] |
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+ | || |
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+ | * [[XeF2 Etch (Xetch)]] |
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+ | * [[Mechanical Polisher (Allied)]] |
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+ | * [[Tube Furnace Wafer Bonding (Thermco)]] |
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+ | * [[E-Beam 1 (Sharon)]] |
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+ | * [[Resistivity Mapper (CDE RESMAP)]] |
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+ | * [[Optical Film Thickness (Nanometric)]] |
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+ | * [[Vapor HF Etch]] |
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+ | * [[Wafer Bonder (Logitech WBS7)]] |
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+ | |} |
Latest revision as of 08:28, 28 October 2021
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About
.
.
.
Tools
Bill Millerski is the supervisor for the following tools.