Difference between revisions of "Bill Millerski"

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=Tools=
 
=Tools=
 
{{PAGENAME}} is the supervisor for the following tools.  
 
{{PAGENAME}} is the supervisor for the following tools.  
 
{|
 
|- valign="top"
 
|
 
=About=
 
 
=Current Work=
 
 
=Tools=
 
Bill Millerski is in charge of the following tools:
 
{{tool|{{PAGENAME}}
 
|picture=FlexAL.jpg
 
{{tool|{{PAGENAME}}
 
|type = Vacuum Deposition
 
|super= Bill Millerski
 
|phone=(805)839-2655
 
|location=Bay 2
 
|email=wmillerski@ucsb.edu
 
 
|toolid=6
 
}}
 
  
 
{|
 
{|
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* [[Stepper 2 (AutoStep 200)]]
 
* [[Stepper 2 (AutoStep 200)]]
 
* [[Ion Beam Deposition (Veeco NEXUS)]]
 
* [[Ion Beam Deposition (Veeco NEXUS)]]
 +
* [[RIE 5 (PlasmaTherm)]]
 +
* [[Rapid Thermal Processor (AET RX6)]]
 +
* [[Rapid Thermal Processor (SSI Solaris 150)]]
 +
* [[Step Profilometer (KLA Tencor P-7)]]
 +
* [[Chemical-Mechanical Polisher (Logitech)]]
 +
||
 +
* [[XeF2 Etch (Xetch)]]
 +
* [[Mechanical Polisher (Allied)]]
 +
* [[Tube Furnace Wafer Bonding (Thermco)]]
 +
* [[E-Beam 1 (Sharon)]]
 +
* [[Resistivity Mapper (CDE RESMAP)]]
 +
* [[Optical Film Thickness (Nanometric)]]
 +
* [[Vapor HF Etch]]
 +
* [[Wafer Bonder (Logitech WBS7)]]
 
|}
 
|}

Latest revision as of 08:28, 28 October 2021